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SNC54LS481JQ

Texas Instruments

SNC54LS481JQ by Texas Instruments

SNC54LS481JQ by Texas Instruments is a MIL-STD-883 Class B (Modified) rated Bit-Slice Micro Processor with 48 terminals. Operating temperature range from -55 to 125 °C, suitable for military applications. Utilizes TTL technology in ceramic package for robust performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,787 parts In-Stock

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Digiode

USA . 3,268 parts In-Stock

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3,268

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Distributors (Availability)

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AZTECH Wire

Italy . 236 parts In-Stock

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$14.333

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236

$14.333

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One Stop Electronics

USA . 724 parts In-Stock

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$17.000

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724

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Corohmni

South Africa . 5,069 parts In-Stock

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$28.770

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Parana Technologies

USA . 537 parts In-Stock

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$62.550

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537

$62.550

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ChromeModa Solutions

Germany . 4,503 parts In-Stock

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$70.281

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$57.630

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4,503

$70.281

$57.630

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IDEA Electronic Components Group

UK . 54 parts In-Stock

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$70.281

100+ parts

$66.767

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$63.253

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54

$70.281

$66.767

$63.253

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DigiPath Technology Company

USA . 1,791 parts In-Stock

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$63.365

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Corphita

USA . 440 parts In-Stock

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Overview

Discover the cutting-edge SNC54LS481JQ by Texas Instruments, a top-of-the-line Bit-Slice Micro Processor designed with precision and reliability in mind. With a MIL-STD-883 Class B screening level and military-grade temperature grade, this product ensures optimal performance in even the most demanding environments. Perfect for applications requiring high-speed data processing, this terminal's 48-pin package offers unmatched efficiency and versatility. Trust Texas Instruments to deliver quality and innovation that exceeds expectations. Elevate your projects with the SNC54LS481JQ today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity, making them ideal for high temperature applications and environments.

Screening Level: MIL-STD-883 Class B (Modified)

This high screening level ensures that the product meets military standards for reliability and quality assurance.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and allow for easy integration into circuit designs.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and functionality in the device.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh operating conditions without performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the product can function in cold environments without issues.

Temperature Grade: MILITARY

Being military-grade, this product is designed to meet stringent requirements for reliability and durability in challenging environments.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

The use of a bit-slice microprocessor allows for efficient processing of data and instructions, making this product suitable for demanding computing tasks.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product energy-efficient and high-performing.

Terminal Form: PIN/PEG

The pin/peg terminal form provides secure connections and ease of installation in electronic systems.

Terminal Pitch: 1.27 mm

Having a small terminal pitch allows for compact packaging and increased density of connections, making this product suitable for space-constrained applications.

Technical Specifications

Bit-Slice Micro Processors SNC54LS481JQ attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XQIP-P48

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

QIP

Package Equivalence Code:

QUIP48A,.6/.8

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SNC54LS481JQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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