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ADSP-1402TG/883B

Analog Devices

ADSP-1402TG/883B by Analog Devices

ADSP-1402TG/883B by Analog Devices is a MILITARY-grade Bit-Slice Micro Processor with 84 terminals in a GRID ARRAY package. Operating temperature ranges from -55 to 125 °C, suitable for robust applications requiring CMOS technology and microprogram sequencing capabilities.

Median Price

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2

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1k+

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Vyrian

USA . 7,934 parts In-Stock

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Digiode

USA . 249 parts In-Stock

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AZTECH Wire

Italy . 658 parts In-Stock

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$7.679

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Semicontronic

India . 641 parts In-Stock

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$8.775

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One Stop Electronics

USA . 905 parts In-Stock

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Corohmni

South Africa . 2,012 parts In-Stock

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Native Components

USA . 809 parts In-Stock

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Northwest PG Solutions

USA . 2,368 parts In-Stock

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Parana Technologies

USA . 427 parts In-Stock

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IDEA Electronic Components Group

UK . 289 parts In-Stock

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DigiPath Technology Company

USA . 2,516 parts In-Stock

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Corphita

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Overview

Upgrade your electronics with the ADSP-1402TG/883B by Analog Devices, a top-tier manufacturer known for exceptional quality and reliability. This Bit-Slice Micro Processor offers unparalleled performance and versatility in a wide range of applications. Experience the value and benefits of this product as it enhances your devices with cutting-edge technology and seamless functionality. Trust Analog Devices to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal performance and reliability, making this product suitable for military applications where durability is a key factor.

Screening Level: 38535Q/M; 38534H; 883B

The high screening level ensures that the product meets stringent military standards for quality and reliability, making it a reliable choice for critical applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into existing systems, making it a convenient choice for design engineers.

No. of Terminals: 84

With a high number of terminals, this product offers flexibility in connecting to other components and peripherals, making it suitable for complex system designs.

Package Style: GRID ARRAY

The grid array package style offers improved electrical performance and thermal characteristics, making this product ideal for high-performance applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this product to withstand harsh environmental conditions, making it suitable for rugged military environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions, making this product suitable for a wide range of environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The Tin/Lead terminal finish provides good solderability and electrical conductivity, making this product easy to assemble and reliable in operation.

Temperature Grade: MILITARY

Designed to meet military standards for temperature range and performance, this product is a reliable choice for critical military applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

The peripheral IC type of bit-slice processor and microprogram sequencer provides powerful processing capabilities and programmability, making this product suitable for demanding computational tasks.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed operation, making it energy-efficient and suitable for battery-powered devices.

Terminal Form: PIN/PEG

The pin/peg terminal form provides easy connectivity and compatibility with standard interfaces, making this product easy to integrate into existing systems.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this product is compatible with common connectors and sockets, making it easy to interface with other components.

Technical Specifications

Bit-Slice Micro Processors ADSP-1402TG/883B attributes and parameters. Explore more Bit-Slice Micro Processors devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P84

JESD-609 Code:

e0

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA84M,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

ADSP-1402TG/883B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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