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SN74ACT7882-30FN

Texas Instruments

SN74ACT7882-30FN by Texas Instruments

SN74ACT7882-30FN by Texas Instruments is a FIFO chip with 2Kx18 organization, 30 ns cycle time, and 33.4 MHz max clock frequency. It operates synchronously at 5V and has a memory density of 36864 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$26.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 741 parts In-Stock

1+ parts

-

100+ parts

$23.040

1k+ parts

$20.610

10k+ parts

$19.400

741

-

$23.040

$20.610

$19.400

DigiKey

USA . 741 parts In-Stock

1+ parts

-

100+ parts

$26.620

1k+ parts

-

10k+ parts

-

741

-

$26.620

-

-

Verical

USA . 489 parts In-Stock

1+ parts

-

100+ parts

$28.800

1k+ parts

$25.762

10k+ parts

$24.250

489

-

$28.800

$25.762

$24.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,440 parts In-Stock

1+ parts

$24.320

100+ parts

-

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1,440

$24.320

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-

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Vyrian

USA . 7,701 parts In-Stock

1+ parts

-

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7,701

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

$4.753

100+ parts

-

1k+ parts

$5.256

10k+ parts

-

1,476

$4.753

-

$5.256

-

DigiPath Technology Company

USA . 1,759 parts In-Stock

1+ parts

$5.233

100+ parts

$4.815

1k+ parts

-

10k+ parts

-

1,759

$5.233

$4.815

-

-

ChromeModa Solutions

Germany . 5,938 parts In-Stock

1+ parts

$5.340

100+ parts

$4.379

1k+ parts

-

10k+ parts

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5,938

$5.340

$4.379

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-

IDEA Electronic Components Group

UK . 982 parts In-Stock

1+ parts

$5.340

100+ parts

-

1k+ parts

$4.806

10k+ parts

-

982

$5.340

-

$4.806

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Ampacity Inc.

Singapore . 273 parts In-Stock

1+ parts

$21.760

100+ parts

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273

$21.760

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Corphita

USA . 1,454 parts In-Stock

1+ parts

$23.040

100+ parts

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1,454

$23.040

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Microchip USA

USA . 338 parts In-Stock

1+ parts

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338

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Overview

Unlock seamless data management and efficient processing with the SN74ACT7882-30FN FIFO by Texas Instruments. Designed with precision and reliability in mind, this FIFO chip carrier offers a high-quality solution for various applications. With a 30 ns cycle time and synchronous operating mode, this device ensures optimal performance at a clock frequency of up to 33.4 MHz. From commercial-grade temperature stability to 3-STATE output characteristics, this versatile chip provides customers with unparalleled value and benefits. Upgrade your systems today with the Texas Instruments SN74ACT7882-30FN and experience the difference in data handling efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection for the internal components of the FIFO, ensuring reliability and longevity.

Cycle Time: 30 ns

The fast cycle time of 30 ns allows for quick data transfer and processing, making this FIFO suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures that data is processed at a consistent rate, improving overall system performance and efficiency.

Nominal Supply Voltage / Vsup (V): 5

This FIFO operates efficiently at a standard supply voltage of 5V, making it compatible with a wide range of systems and applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this FIFO energy-efficient and reliable for operation.

Maximum Clock Frequency (fCLK): 33.4 MHz

The high maximum clock frequency of 33.4 MHz allows for fast data transfer and processing speeds, making this FIFO ideal for high-performance applications.

Memory Width: 18

With a memory width of 18 bits, this FIFO can handle large amounts of data simultaneously, making it suitable for data-intensive tasks.

Technical Specifications

FIFO SN74ACT7882-30FN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

18 ns

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

68

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.23 mm

Trade Compliance

SN74ACT7882-30FN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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