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SN74ABT3613-15PCB

Texas Instruments

SN74ABT3613-15PCB by Texas Instruments

SN74ABT3613-15PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 15ns cycle time, and 66.7MHz clock frequency. It operates synchronously at 5V, has a low profile flatpack package style, and is ideal for parallel data storage applications.

Median Price

$18.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,155 parts In-Stock

1+ parts

-

100+ parts

$18.380

1k+ parts

-

10k+ parts

-

1,155

-

$18.380

-

-

Rochester

USA . 1,140 parts In-Stock

1+ parts

-

100+ parts

$15.900

1k+ parts

$14.230

10k+ parts

$13.390

1,140

-

$15.900

$14.230

$13.390

Verical

USA . 782 parts In-Stock

1+ parts

-

100+ parts

$19.875

1k+ parts

$17.788

10k+ parts

$16.738

782

-

$19.875

$17.788

$16.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,032 parts In-Stock

1+ parts

$16.786

100+ parts

-

1k+ parts

-

10k+ parts

-

4,032

$16.786

-

-

-

Vyrian

USA . 2,712 parts In-Stock

1+ parts

$17.670

100+ parts

-

1k+ parts

-

10k+ parts

-

2,712

$17.670

-

-

-

DigiKey Marketplace

USA . 1,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,155

-

-

-

-

LWI Electronics Inc

India . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,555 parts In-Stock

1+ parts

$3.095

100+ parts

-

1k+ parts

$3.613

10k+ parts

-

1,555

$3.095

-

$3.613

-

DigiPath Technology Company

USA . 1,801 parts In-Stock

1+ parts

$3.407

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

$3.407

-

-

-

ChromeModa Solutions

Germany . 3,256 parts In-Stock

1+ parts

$3.477

100+ parts

$2.851

1k+ parts

-

10k+ parts

-

3,256

$3.477

$2.851

-

-

IDEA Electronic Components Group

UK . 214 parts In-Stock

1+ parts

$3.477

100+ parts

-

1k+ parts

$3.129

10k+ parts

-

214

$3.477

-

$3.129

-

Ampacity Inc.

Singapore . 821 parts In-Stock

1+ parts

$15.020

100+ parts

-

1k+ parts

-

10k+ parts

-

821

$15.020

-

-

-

Corphita

USA . 1,830 parts In-Stock

1+ parts

$15.903

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

$15.903

-

-

-

Microchip USA

USA . 348 parts In-Stock

1+ parts

$51.460

100+ parts

$50.730

1k+ parts

$50.360

10k+ parts

$49.990

348

$51.460

$50.730

$50.360

$49.990

Overview

Experience top-notch quality and performance with the SN74ABT3613-15PCB by Texas Instruments, a leading manufacturer in the industry. This FIFO memory device offers seamless operation in synchronous mode with a fast cycle time of 15 ns, making it ideal for a wide range of applications. With a nominal supply voltage of 5V and a maximum clock frequency of 66.7 MHz, this product delivers exceptional reliability and efficiency. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the SN74ABT3613-15PCB and experience unparalleled value and advantages today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to environmental factors, ensuring the product's longevity and reliability.

Cycle Time: 15 ns

A fast cycle time of 15 nanoseconds allows for quick data retrieval and processing, making the product suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures synchronized data transfers, reducing the chances of data errors and enhancing overall system performance.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard voltage of 5 volts makes it compatible with a wide range of systems and applications, ensuring easy integration.

Maximum Clock Frequency (fCLK): 66.7 MHz

A high clock frequency of 66.7 MHz allows for rapid data processing and efficient operation in demanding environments.

Memory Density: 2304 bit

With a high memory density of 2304 bits, this FIFO product can store a large amount of data, making it suitable for data-intensive tasks.

Output Enable: YES

The ability to enable or disable the output allows for efficient control over data flow, increasing flexibility and usability in various applications.

Technical Specifications

FIFO SN74ABT3613-15PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

10 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ABT3613-15PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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