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SN74ACT7813-40DLR

Texas Instruments

SN74ACT7813-40DLR by Texas Instruments

SN74ACT7813-40DLR by Texas Instruments is a FIFO with 64x18 organization, 40ns cycle time, and 25MHz max clock frequency. It operates synchronously at 5V and has a memory density of 1152 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$4.330

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

$3.360

10k+ parts

$3.160

1,000

-

$3.750

$3.360

$3.160

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.330

1k+ parts

-

10k+ parts

-

1,000

-

$4.330

-

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$4.688

1k+ parts

$4.200

10k+ parts

$3.950

750

-

$4.688

$4.200

$3.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,255 parts In-Stock

1+ parts

$3.952

100+ parts

-

1k+ parts

-

10k+ parts

-

3,255

$3.952

-

-

-

Vyrian

USA . 2,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,018

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,300 parts In-Stock

1+ parts

$3.744

100+ parts

-

1k+ parts

-

10k+ parts

-

4,300

$3.744

-

-

-

Parana Technologies

USA . 1,887 parts In-Stock

1+ parts

$3.896

100+ parts

-

1k+ parts

$4.373

10k+ parts

-

1,887

$3.896

-

$4.373

-

DigiPath Technology Company

USA . 2,061 parts In-Stock

1+ parts

$4.290

100+ parts

$3.947

1k+ parts

-

10k+ parts

-

2,061

$4.290

$3.947

-

-

IDEA Electronic Components Group

UK . 1,953 parts In-Stock

1+ parts

$4.378

100+ parts

-

1k+ parts

$3.940

10k+ parts

-

1,953

$4.378

-

$3.940

-

ChromeModa Solutions

Germany . 803 parts In-Stock

1+ parts

$4.378

100+ parts

$3.590

1k+ parts

-

10k+ parts

-

803

$4.378

$3.590

-

-

Microchip USA

USA . 349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

349

-

-

-

-

Overview

Enhance your electronics projects with the SN74ACT7813-40DLR FIFO by Texas Instruments. Known for their top-notch quality and reliability, this FIFO device offers seamless data storage and retrieval in a compact package. Ideal for applications requiring fast data transfer speeds, this product operates synchronously with a cycle time of 40 ns, making it perfect for a wide range of projects. Unlock the benefits of efficient data handling and maximize your project's potential with the SN74ACT7813-40DLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product.

Surface Mount: YES

Surface mount feature makes installation easy and saves space on the circuit board.

Cycle Time: 40 ns

Fast cycle time of 40 ns ensures quick data processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space and allows for compact design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can perform reliably in various environments.

Organization: 64X18

The organization of 64X18 allows for efficient data storage and retrieval.

Maximum Clock Frequency (fCLK): 25 MHz

A maximum clock frequency of 25 MHz enables high-speed data transfer.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures good connectivity and corrosion resistance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

FIFO SN74ACT7813-40DLR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

20 ns

Maximum Clock Frequency (fCLK):

25 MHz

Cycle Time:

40 ns

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

1152 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

56

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ACT7813-40DLR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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