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SMJ32020FDS

Texas Instruments

SMJ32020FDS by Texas Instruments

The Texas Instruments SMJ32020FDS is a 16-bit DSP with NMOS technology, operating b/w -55°C to 100°C. It features a ceramic-metal sealed co-fired package, square shape, and chip carrier style. With an external data bus width of 16, it's ideal for applications requiring fixed-point format and barrel shifter functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,298 parts In-Stock

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3,298

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Digiode

USA . 2,193 parts In-Stock

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2,193

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Distributors (Availability)

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AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$12.284

100+ parts

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395

$12.284

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One Stop Electronics

USA . 1,177 parts In-Stock

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$22.000

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1,177

$22.000

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Parana Technologies

USA . 2,219 parts In-Stock

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$36.496

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2,219

$36.496

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DigiPath Technology Company

USA . 2,106 parts In-Stock

1+ parts

$40.187

100+ parts

$36.972

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2,106

$40.187

$36.972

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ChromeModa Solutions

Germany . 6,917 parts In-Stock

1+ parts

$41.007

100+ parts

$33.626

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6,917

$41.007

$33.626

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IDEA Electronic Components Group

UK . 1,060 parts In-Stock

1+ parts

$41.007

100+ parts

$38.957

1k+ parts

$36.906

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1,060

$41.007

$38.957

$36.906

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Corohmni

South Africa . 866 parts In-Stock

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$82.362

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866

$82.362

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Corphita

USA . 4,256 parts In-Stock

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4,256

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SMJ32020FDS Digital Signal Processor. Crafted by a trusted industry leader, this high-quality DSP offers unparalleled performance in a compact package. Ideal for a wide range of applications, from audio processing to telecommunications, this chip delivers exceptional value and efficiency. Stay ahead of the curve with the SMJ32020FDS - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and protection, making the DSP suitable for harsh environments or industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Address Bus Width: 16

A wider address bus allows for efficient processing of data and instructions, enhancing overall performance and speed of the DSP.

Package Shape: SQUARE

The square package shape offers a compact design that can fit well within limited space constraints, making it ideal for smaller electronic devices.

No. of Terminals: 68

With a high number of terminals, the DSP can support various input/output connections and peripherals, enabling versatile functionality and connectivity.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides ease of handling and installation, facilitating streamlined manufacturing processes and assembly.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, offering stability and durability in various applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the DSP to function effectively in cold environments, expanding its usability across different temperature ranges.

Terminal Position: QUAD

The quad terminal position offers efficient connectivity and integration with other components, enhancing the overall functionality and compatibility of the DSP.

Maximum Seated Height: 3.05 mm

The low maximum seated height allows for a slim and compact design, making the DSP suitable for space-constrained applications without compromising performance.

Width: 24.13 mm

The moderate width of the DSP ensures compatibility with standard board sizes and layouts, simplifying integration into various electronic systems.

External Data Bus Width: 16

The 16-bit external data bus width enables efficient data transfer and processing, enhancing the speed and performance of the DSP in handling complex computations.

Length: 24.13 mm

The length of the DSP aligns with industry standards, ensuring seamless integration and compatibility with existing hardware and systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type supports a wide range of additional functions and features, enhancing the versatility and capabilities of the device for diverse applications.

Technology: NMOS

Utilizing NMOS technology offers high-speed operation and low power consumption, making the DSP energy-efficient and suitable for performance-oriented tasks.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing and assembly processes, reducing the risk of soldering errors and ensuring reliable connections for the DSP.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides stable power input for the DSP, ensuring consistent and reliable performance in various operating conditions.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for compact and efficient layout designs, enabling high-density integration of components and peripherals around the DSP.

Format: FIXED POINT

Using a fixed-point format simplifies the implementation of algorithms and signal processing operations, enabling precise and accurate computations within the DSP.

Barrel Shifter: YES

Inclusion of a barrel shifter enhances the DSP's ability to perform complex arithmetic and logical operations efficiently, improving overall processing speed and flexibility.

Technical Specifications

Digital Signal Processors (DSPs) SMJ32020FDS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Boundary Scan:

NO

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-CQCC-N68

Length:

24.13 mm

Low Power Mode:

NO

No. of Terminals:

68

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

SMJ32020FDS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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