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SMJ320C30KGDM50C

Texas Instruments

SMJ320C30KGDM50C by Texas Instruments

SMJ320C30KGDM50C by Texas Instruments is a 32-bit DSP with 2048 RAM words, operating at 50 MHz. Ideal for military applications due to MIL-PRF-38535 screening level and -55 to 125 °C temperature range. Features include CMOS technology, 5V supply voltage, and barrel shifter for efficient signal processing.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 680 parts In-Stock

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$15.910

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One Stop Electronics

USA . 230 parts In-Stock

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Parana Technologies

USA . 2,081 parts In-Stock

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Ampacity Inc.

Singapore . 136 parts In-Stock

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DigiPath Technology Company

USA . 1,777 parts In-Stock

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ChromeModa Solutions

Germany . 6,735 parts In-Stock

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IDEA Electronic Components Group

UK . 1,793 parts In-Stock

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Corohmni

South Africa . 5,175 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Aranea Global

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Overview

Experience cutting-edge technology with the SMJ320C30KGDM50C by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and reliability, making this digital signal processor (DSP) a top choice for a wide range of applications. From aerospace to telecommunications, this versatile DSP offers exceptional value, benefits, and advantages to customers looking for high-performance solutions. Take your projects to the next level with the SMJ320C30KGDM50C and discover the difference that Texas Instruments can make in your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easier integration onto printed circuit boards, saving space and reducing manufacturing costs.

Address Bus Width: 24

A wider address bus width allows for larger memory addressing capabilities, enabling more efficient data processing and storage.

Screening Level: MIL-PRF-38535

This screening level ensures high reliability and performance in harsh operating environments, making it suitable for military applications.

Bit Size: 32

A 32-bit architecture allows for processing of larger data chunks and more complex algorithms, improving overall performance.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power sources, simplifying system design and integration.

No. of Terminals: 204

Having a higher number of terminals provides more connectivity options and interfaces, enhancing versatility in different applications.

Package Style (Meter): UNCASED CHIP

The unencased chip package style offers flexibility in mounting and customization, allowing for tailored solutions in various form factors.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliable performance in extreme conditions, suitable for rugged environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range allows for operation in cold environments, expanding the range of potential applications.

RAM Words: 2048

With 2048 RAM words, the processor can handle larger data sets and execute more complex tasks efficiently.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for fast data transfer rates and seamless communication with external devices.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz enables high-speed processing, enhancing real-time performance capabilities.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel processing and improved efficiency in handling multiple tasks simultaneously.

Temperature Grade: MILITARY

Designed for military-grade applications, the processor meets stringent requirements for reliability, durability, and performance in extreme conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, this product is optimized for handling complex signal processing tasks with high precision and accuracy.

Technology: CMOS

CMOS technology offers low power consumption, higher speed, and better noise immunity, enhancing overall performance and efficiency.

Maximum Supply Current: 600 mA

With a maximum supply current of 600 mA, the processor can operate reliably within specified power limits, ensuring stable performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies system integration.

Format: FLOATING POINT

Supporting floating-point format enables precise mathematical calculations and improved accuracy for complex algorithms and signal processing tasks.

Barrel Shifter: YES

Having a barrel shifter functionality allows for efficient data manipulation and bit shifting operations, enhancing computational capabilities.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C30KGDM50C attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-XUUC-N204

Low Power Mode:

NO

No. of Terminals:

204

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Screening Level:

MIL-PRF-38535

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SMJ320C30KGDM50C Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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