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SMJ320C10-14FDM

Texas Instruments

SMJ320C10-14FDM by Texas Instruments

SMJ320C10-14FDM by Texas Instruments is a 44-terminal DSP with 16-bit data RAM and external bus width. Operating at 14.4 MHz, it's ideal for military-grade applications requiring fixed-point format and barrel shifter functionality. With a ceramic-metal package, this CMOS technology chip supports a wide temperature range from -55 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,557 parts In-Stock

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Digiode

USA . 4,526 parts In-Stock

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4,526

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AZTECH Wire

Italy . 384 parts In-Stock

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$6.110

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384

$6.110

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One Stop Electronics

USA . 1,497 parts In-Stock

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$34.000

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$34.000

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Corohmni

South Africa . 5,033 parts In-Stock

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$54.325

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$54.325

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Parana Technologies

USA . 1,501 parts In-Stock

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$70.961

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$6,589.850

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$63.865

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1,501

$70.961

$6,589.850

$63.865

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DigiPath Technology Company

USA . 1,673 parts In-Stock

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$78.137

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ChromeModa Solutions

Germany . 4,361 parts In-Stock

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$79.732

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$65.380

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4,361

$79.732

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IDEA Electronic Components Group

UK . 1,727 parts In-Stock

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$79.732

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$75.745

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$71.759

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Corphita

USA . 166 parts In-Stock

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Overview

Experience unparalleled performance with the Texas Instruments SMJ320C10-14FDM Digital Signal Processor. Crafted with precision and expertise, this chip carrier package offers military-grade reliability and cutting-edge CMOS technology. Ideal for a wide range of applications, from telecommunications to audio processing, this DSP boasts a maximum clock frequency of 14.4 MHz, ensuring seamless operation. Trust in Texas Instruments to deliver high-quality solutions that elevate your projects to new heights of efficiency and functionality.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material offers excellent durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in power source options.

On Chip Data RAM Width: 16

Generous data RAM width allows for efficient storage and processing of data, enhancing performance.

Address Bus Width: 12

Having a wide address bus width enables access to a large memory space, enabling complex algorithms and applications to be run smoothly.

Package Shape: SQUARE

Square package shape helps in optimizing the use of space on the PCB, allowing for efficient layout and design.

No. of Terminals: 44

Having a sufficient number of terminals facilitates easy connections and interfacing with other components in the system.

Minimum Supply Voltage: 4.5 V

The ability to operate at low supply voltages makes the product energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in extreme environmental conditions.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows the product to function effectively in both hot and cold environments.

Terminal Position: QUAD

Quad terminal position configuration simplifies the connection process and improves overall system reliability.

Maximum Seated Height: 3.05 mm

Low seated height contributes to a compact design, saving space and allowing for versatility in product placement.

RAM Words: 144

More RAM words provide ample storage capacity for data processing, enhancing the product's performance in handling complex calculations.

Width: 16.51 mm

Compact width dimension allows for easy integration into a variety of electronic devices and circuit board layouts.

External Data Bus Width: 16

Matching external data bus width with on-chip data RAM width ensures efficient data transfer and processing capabilities.

Maximum Clock Frequency: 14.4 MHz

High clock frequency enables fast data processing and execution of complex algorithms, improving overall system performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow within the processor, optimizing performance and minimizing bottlenecks.

Length: 16.51 mm

Balanced length dimension complements the width dimension, enabling a compact and space-efficient product design.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability and functionality in harsh operating environments, making the product suitable for defense and aerospace applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Multi-functional peripheral IC type enhances versatility and compatibility with various applications and systems, offering flexibility in design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and improves reliability by eliminating solder joints prone to failure.

Maximum Supply Current: 50 mA

Low supply current consumption contributes to energy efficiency and extends battery life in portable and mobile applications.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with common power sources, simplifying integration into existing systems.

ROM Programmability: MROM

Mask ROM programmability enhances security and reliability of stored data, protecting valuable information from unauthorized access or tampering.

Terminal Pitch: 1.27 mm

Optimal terminal pitch spacing facilitates accurate and reliable connections during assembly, reducing the risk of signal interference or short circuits.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves computational efficiency, making the product well-suited for real-time signal processing applications.

Barrel Shifter: YES

Presence of a barrel shifter enhances data manipulation and shifting capabilities, enabling faster and more efficient processing of complex algorithms and computations.

On Chip Program ROM Width: 16

Wide on-chip program ROM width enables storage and execution of a large number of instructions, supporting the implementation of advanced algorithms and software applications.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C10-14FDM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ROM PROTECT

Address Bus Width:

12

Barrel Shifter:

YES

Boundary Scan:

NO

Maximum Clock Frequency:

14.4 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQCC-N44

Length:

16.51 mm

Low Power Mode:

NO

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of Serial I/Os:

0

No. of Terminals:

44

No. of Timers:

0

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

144

ROM Programmability:

MROM

Maximum Seated Height:

3.05 mm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

SMJ320C10-14FDM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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