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SMJ320C10-25JDM

Texas Instruments

SMJ320C10-25JDM by Texas Instruments

SMJ320C10-25JDM by Texas Instruments is a 16-bit DSP with max clock freq of 25.6 MHz, operating temp range -55 to 125 °C. Ideal for military applications due to MIL screening level and ceramic-metal package body material. With on-chip data RAM width of 16 bits, it offers high performance in digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,533 parts In-Stock

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Digiode

USA . 1,027 parts In-Stock

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1,027

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R&J Components

USA . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$8.232

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660

$8.232

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One Stop Electronics

USA . 1,267 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 339 parts In-Stock

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$55.222

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339

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DigiPath Technology Company

USA . 673 parts In-Stock

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$60.806

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$55.942

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673

$60.806

$55.942

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ChromeModa Solutions

Germany . 3,015 parts In-Stock

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$62.047

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$50.879

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3,015

$62.047

$50.879

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IDEA Electronic Components Group

UK . 2,225 parts In-Stock

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$62.047

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$58.945

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$55.842

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2,225

$62.047

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$55.842

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Corphita

USA . 1,439 parts In-Stock

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1,439

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SMJ320C10-25JDM by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this DSP offers customers exceptional value and benefits. Experience seamless performance and efficiency with the SMJ320C10-25JDM, designed to meet your specific needs and exceed your expectations. Elevate your projects to new heights with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability for long-term usage

Maximum Supply Voltage: 5.5 V

Allows for a wider range of power supply options

On Chip Data RAM Width: 16

Offers ample memory storage for processing and data manipulation

Address Bus Width: 12

Enables efficient communication and data transfer within the processor

Screening Level: 38535Q/M;38534H;883B

Ensures high quality and reliability of the product

Maximum Clock Frequency: 25.6 MHz

Provides fast processing speeds for quick data analysis and signal processing

Technology: CMOS

Offers low power consumption and high noise immunity

Temperature Grade: MILITARY

Suitable for use in harsh environments and military applications

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C10-25JDM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ROM PROTECT

Address Bus Width:

12

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

25.6 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-CDIP-T40

Low Power Mode:

NO

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of Serial I/Os:

0

No. of Terminals:

40

No. of Timers:

0

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

144

ROM Programmability:

MROM

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SMJ320C10-25JDM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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