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SMJ320C10FZM

Texas Instruments

SMJ320C10FZM by Texas Instruments

The Texas Instruments SMJ320C10FZM is a 16-bit DSP with 144 RAM words, operating at temperatures from -55 to 125°C. It has a supply voltage of 5V and max current draw of 50mA. Ideal for military applications requiring digital signal processing in a ceramic chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,476 parts In-Stock

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2,476

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Vyrian

USA . 2,199 parts In-Stock

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2,199

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,354 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,354

$4.000

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AZTECH Wire

Italy . 897 parts In-Stock

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$14.906

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897

$14.906

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Parana Technologies

USA . 1,459 parts In-Stock

1+ parts

$20.654

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$20.767

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1,459

$20.654

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$20.767

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DigiPath Technology Company

USA . 766 parts In-Stock

1+ parts

$22.743

100+ parts

$20.923

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766

$22.743

$20.923

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ChromeModa Solutions

Germany . 2,437 parts In-Stock

1+ parts

$23.207

100+ parts

$19.030

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2,437

$23.207

$19.030

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IDEA Electronic Components Group

UK . 2,245 parts In-Stock

1+ parts

$23.207

100+ parts

$22.047

1k+ parts

$20.886

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2,245

$23.207

$22.047

$20.886

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Corphita

USA . 4,280 parts In-Stock

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4,280

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments SMJ320C10FZM digital signal processor. Crafted with precision and excellence, this DSP offers unparalleled performance and reliability for a wide range of applications. From military-grade operations to mixed signal processing, this chip carrier package delivers exceptional value and benefits to customers seeking top-notch quality and efficiency. Elevate your projects to new heights with the SMJ320C10FZM by Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and durability, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability makes for easier and more efficient PCB assembly, saving time and effort during production.

Bit Size: 16

A 16-bit architecture allows for high precision processing of digital signals, making this DSP suitable for applications requiring complex calculations.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage makes integration into existing systems seamless and minimizes the need for additional circuitry.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this DSP is rugged and reliable for use in harsh environments where temperature fluctuations and extreme conditions may be present.

Technology: CMOS

CMOS technology offers low power consumption and high speed capabilities, making this DSP efficient and fast for processing digital signals.

Maximum Supply Current: 50 mA

With a maximum supply current of 50mA, this DSP is energy-efficient and helps to minimize power consumption for longer device operation.

Nominal Supply Voltage: 5 V

Operating at a 5V nominal supply voltage ensures compatibility with a wide range of systems and reduces the need for additional voltage regulation components.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C10FZM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-XQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

144

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

50 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SMJ320C10FZM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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