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SMJ320C10-14JDM

Texas Instruments

SMJ320C10-14JDM by Texas Instruments

SMJ320C10-14JDM by Texas Instruments is a 16-bit DSP with 5V supply, 14.4 MHz clock frequency, and MILITARY temperature grade. Ideal for digital signal processing applications requiring high-speed data processing in harsh environments. Features include 144 RAM words, MROM ROM programmability, and a ceramic-metal-sealed co-fired package body.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,637 parts In-Stock

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2,637

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Digiode

USA . 122 parts In-Stock

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122

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Distributors (Availability)

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One Stop Electronics

USA . 313 parts In-Stock

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$2.000

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313

$2.000

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AZTECH Wire

Italy . 860 parts In-Stock

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$12.961

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860

$12.961

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Parana Technologies

USA . 1,030 parts In-Stock

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$69.416

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$69.416

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DigiPath Technology Company

USA . 1,993 parts In-Stock

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$76.436

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$70.321

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1,993

$76.436

$70.321

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ChromeModa Solutions

Germany . 6,092 parts In-Stock

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$77.996

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$63.957

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6,092

$77.996

$63.957

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IDEA Electronic Components Group

UK . 2,119 parts In-Stock

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$77.996

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$74.096

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$70.196

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2,119

$77.996

$74.096

$70.196

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Corphita

USA . 712 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments SMJ320C10-14JDM Digital Signal Processor. As a trusted leader in semiconductor technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. From audio processing to telecommunications, this DSP offers high-speed operation and efficient data handling. With a robust package design and military-grade temperature tolerance, this product ensures seamless integration into your systems. Elevate your projects with the superior quality and advanced features of the SMJ320C10-14JDM from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This sturdy material ensures durability and reliability of the product, making it suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of supply voltage tolerance, providing flexibility in power sources.

On Chip Data RAM Width: 16

Wide data RAM width allows for efficient processing and storage of data, enhancing overall performance.

Address Bus Width: 12

With a larger address bus width, the processor can access a greater range of memory locations, enabling faster operations.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and allows for easier integration into circuit designs.

Maximum Clock Frequency: 14.4 MHz

High clock frequency enables fast signal processing, making it suitable for real-time applications.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type indicates that the product is designed specifically for digital signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C10-14JDM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ROM PROTECT

Address Bus Width:

12

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

14.4 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-CDIP-T40

Low Power Mode:

NO

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of Serial I/Os:

0

No. of Terminals:

40

No. of Timers:

0

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

144

ROM Programmability:

MROM

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SMJ320C10-14JDM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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