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SMJ320C10FDM

Texas Instruments

SMJ320C10FDM by Texas Instruments

SMJ320C10FDM by Texas Instruments is a 16-bit DSP with max supply voltage of 5.5V, clock frequency up to 20.5MHz, and on-chip data RAM width of 16 bits. Ideal for military applications due to its MIL-graded temperature range and fixed-point format, it features a ceramic-metal package body suitable for surface mounting in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,359 parts In-Stock

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Digiode

USA . 1,201 parts In-Stock

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1,201

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Distributors (Availability)

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AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$5.199

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$5.199

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One Stop Electronics

USA . 281 parts In-Stock

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$12.000

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Parana Technologies

USA . 193 parts In-Stock

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$21.028

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$21.259

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DigiPath Technology Company

USA . 1,164 parts In-Stock

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$23.154

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$21.302

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$23.154

$21.302

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ChromeModa Solutions

Germany . 4,937 parts In-Stock

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$23.627

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$19.374

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4,937

$23.627

$19.374

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IDEA Electronic Components Group

UK . 1,178 parts In-Stock

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$23.627

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$22.446

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$21.264

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1,178

$23.627

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$21.264

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Corphita

USA . 2,292 parts In-Stock

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Overview

Elevate your signal processing capabilities with the Texas Instruments SMJ320C10FDM, a high-quality digital signal processor designed for optimal performance. Manufactured by industry leader Texas Instruments, this DSP offers unmatched value and benefits for a wide range of applications. With advanced features and reliable technology, this product is perfect for maximizing efficiency and accuracy in your projects. Upgrade your systems today with the SMJ320C10FDM and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and electrical insulation, making the product reliable and durable in various operating conditions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance allows flexibility in power supply options and ensures stable performance under varying voltage conditions.

Address Bus Width: 12

A 12-bit address bus width enables efficient memory addressing and access, optimizing the overall performance of the DSP.

Bit Size: 16

With a 16-bit computing capability, the DSP can handle complex mathematical operations and signal processing tasks with high precision and accuracy.

Maximum Clock Frequency: 20.5 MHz

The high maximum clock frequency allows for fast processing speed and real-time operation, making the DSP suitable for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C10FDM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ROM PROTECT

Address Bus Width:

12

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

20.5 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQCC-N44

Length:

16.51 mm

Low Power Mode:

NO

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of Serial I/Os:

0

No. of Terminals:

44

No. of Timers:

0

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC44,.65SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

144

ROM Programmability:

MROM

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

3.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

SMJ320C10FDM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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