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SMJ32020GBL

Texas Instruments

SMJ32020GBL by Texas Instruments

SMJ32020GBL by Texas Instruments is a 16-bit DSP with 544 RAM words, MOS technology, and operates b/w 0-70°C. It comes in a ceramic square package with 68 terminals in grid array style. Ideal for commercial applications requiring fixed-point processing at high speeds.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 9,050 parts In-Stock

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Digiode

USA . 929 parts In-Stock

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Resion

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Electronic Expediters

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One Stop Electronics

USA . 1,140 parts In-Stock

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$12.000

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$12.000

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AZTECH Wire

Italy . 494 parts In-Stock

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$12.763

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Parana Technologies

USA . 1,136 parts In-Stock

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$51.623

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DigiPath Technology Company

USA . 520 parts In-Stock

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$56.843

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ChromeModa Solutions

Germany . 2,430 parts In-Stock

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$58.003

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$47.562

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IDEA Electronic Components Group

UK . 824 parts In-Stock

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$58.003

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$55.103

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$52.203

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Corphita

USA . 2,064 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SMJ32020GBL Digital Signal Processor. Crafted with precision and expertise by a trusted industry leader, this DSP is designed to elevate your audio, video, and communication applications to new heights. With its advanced features and reliable performance, this product offers unmatched value and benefits to customers seeking optimal signal processing solutions. Upgrade your projects with the SMJ32020GBL and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material is known for its high thermal conductivity and reliability, making it suitable for electronic components that need to operate at high temperatures.

Screening Level: 38535Q/M; 38534H; 883B

This screening level ensures that the DSPs meet specific quality and reliability standards, making them suitable for use in critical applications.

Bit Size: 16

A 16-bit DSP allows for higher precision calculations and processing, making it ideal for applications that require complex algorithms or high performance.

No. of Terminals: 68

Having 68 terminals provides flexibility in connecting the DSP to other components or peripherals, allowing for versatile and customized system designs.

RAM Words: 544

With 544 RAM words, the DSP can efficiently store and access data for processing, enabling faster execution of operations and better overall performance.

Temperature Grade: COMMERCIAL

Designed for commercial use, this DSP can operate within a temperature range suitable for most consumer electronics applications.

Technical Specifications

Digital Signal Processors (DSPs) SMJ32020GBL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-XPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

RAM Words:

544

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Digital Signal Processors

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SMJ32020GBL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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