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SMJ320C10-25FZM

Texas Instruments

SMJ320C10-25FZM by Texas Instruments

SMJ320C10-25FZM by Texas Instruments is a 16-bit DSP with 144 RAM words, operating at -55 to 125 °C. Ideal for military applications, it features a 5V supply voltage and consumes up to 60mA current. This CMOS technology chip carrier has a quad terminal position and J bend form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,115 parts In-Stock

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Digiode

USA . 464 parts In-Stock

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464

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Distributors (Availability)

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AZTECH Wire

Italy . 886 parts In-Stock

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$17.333

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886

$17.333

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One Stop Electronics

USA . 1,240 parts In-Stock

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$24.000

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Parana Technologies

USA . 1,494 parts In-Stock

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$36.503

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DigiPath Technology Company

USA . 36 parts In-Stock

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$40.195

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$36.979

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36

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$36.979

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IDEA Electronic Components Group

UK . 1,262 parts In-Stock

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$41.015

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$38.964

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$36.914

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1,262

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ChromeModa Solutions

Germany . 1,094 parts In-Stock

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$41.015

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$33.632

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Corohmni

South Africa . 1,153 parts In-Stock

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$70.644

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Corphita

USA . 392 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the SMJ320C10-25FZM by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers cutting-edge technology in a compact ceramic package that guarantees reliability and durability. Perfect for military-grade applications, this DSP offers unmatched processing power with 16-bit precision, making it ideal for a wide range of digital signal processing tasks. Experience the ultimate value and benefits of superior performance with the SMJ320C10-25FZM.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide better thermal conductivity and mechanical strength, making the product more reliable and durable.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of applications and power sources.

RAM Words: 144

Having a larger RAM capacity allows for more data storage and processing capability, enabling complex calculations and algorithms to be run efficiently.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making the product energy efficient and compact.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C10-25FZM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-XQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

144

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SMJ320C10-25FZM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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