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SM32C6713BGDPM30EP

Texas Instruments

SM32C6713BGDPM30EP by Texas Instruments

Texas Instruments SM32C6713BGDPM30EP is a 32-bit DSP with integrated cache, operating at 250 MHz. Ideal for military applications, it features 22-bit address bus width and low power mode support. With a max supply voltage of 1.32 V, this DSP offers high performance in a compact square package.

Median Price

$68.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 291 parts In-Stock

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$68.750

100+ parts

$63.250

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291

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Vyrian

USA . 4,745 parts In-Stock

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Digiode

USA . 2,777 parts In-Stock

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2,777

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Chip Stock

USA . 911 parts In-Stock

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911

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Cyclops Electronics Ltd

UK . 267 parts In-Stock

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267

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,633 parts In-Stock

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$1.000

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1,633

$1.000

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AZTECH Wire

Italy . 736 parts In-Stock

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$15.150

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One Stop Electronics

USA . 314 parts In-Stock

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$28.000

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Microchip USA

USA . 1,907 parts In-Stock

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$31.050

100+ parts

$30.610

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$30.390

10k+ parts

$30.160

1,907

$31.050

$30.610

$30.390

$30.160

Parana Technologies

USA . 623 parts In-Stock

1+ parts

$31.252

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$75.823

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623

$31.252

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$75.823

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ChromeModa Solutions

Germany . 3,869 parts In-Stock

1+ parts

$35.115

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$28.794

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3,869

$35.115

$28.794

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IDEA Electronic Components Group

UK . 1,434 parts In-Stock

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$35.115

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$33.359

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$31.604

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1,434

$35.115

$33.359

$31.604

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Corohmni

South Africa . 1,099 parts In-Stock

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$37.927

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Lixinc

USA . 13,606 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,172 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 1,308 parts In-Stock

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$31.660

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Perfect Parts

USA . 200 parts In-Stock

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200

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GreenTree Electronics

Israel . 154 parts In-Stock

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Overview

Experience top-tier performance and reliability with the SM32C6713BGDPM30EP by Texas Instruments, a leading manufacturer in the industry. This powerful Digital Signal Processor (DSP) is perfect for a wide range of applications, offering seamless integration and high-speed processing capabilities. Elevate your projects with the unmatched value and benefits that this product provides, ensuring optimal performance and efficiency every step of the way. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material helps in reducing the overall weight of the product, making it easier to handle and transport.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, leading to faster execution of tasks.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for better performance and stability of the DSP.

Address Bus Width: 22

With a wider address bus width, the DSP can access a larger memory space, enabling it to handle more complex algorithms and data processing tasks.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on the circuit board, allowing for a more compact and streamlined design.

Bit Size: 32

A 32-bit architecture enhances the computational capabilities of the DSP, enabling it to handle high-speed data processing with precision.

Power Supplies (V): 1.2,3.3

Having multiple power supply options ensures compatibility with different voltage requirements, making the DSP versatile and adaptable to a variety of applications.

No. of Terminals: 272

The large number of terminals allows for seamless connectivity and communication with other components, enhancing the overall functionality of the DSP.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy installation and soldering onto the circuit board, making the assembly process efficient and reliable.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage ensures energy efficiency and optimal performance of the DSP, reducing power consumption and heat generation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and operate reliably in demanding applications.

No. of External Interrupts: 4

Having multiple external interrupts allows the DSP to efficiently handle simultaneous tasks and respond to external events in real-time.

Minimum Operating Temperature: -55 °C

The wide operating temperature range enables the DSP to function optimally in extreme cold conditions, making it suitable for a variety of industrial and automotive applications.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and ensures robust connections, enhancing the overall durability and reliability of the DSP.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and allows for efficient heat dissipation, ensuring the longevity of the DSP.

Maximum Seated Height: 2.57 mm

The low seated height makes the DSP suitable for compact designs and applications where space is limited, without compromising on performance.

Width: 27 mm

The moderate width of the DSP allows for easy integration into various electronic systems and devices, making it a versatile choice for different applications.

Boundary Scan: YES

The boundary scan feature enables easy testing and debugging of the DSP, ensuring faster development cycles and improved product quality.

External Data Bus Width: 32

A wide external data bus width enhances the data transfer capabilities of the DSP, enabling high-speed communication with external peripherals and memory modules.

Maximum Clock Frequency: 250 MHz

With a high maximum clock frequency, the DSP can achieve fast processing speeds and real-time responsiveness, making it suitable for time-critical applications.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance ensures the reliable and secure soldering of the DSP during the assembly process, preventing solder joint failures.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for parallel processing and efficient data transfer within the DSP, enhancing its overall performance and capabilities.

Length: 27 mm

The moderate length of the DSP makes it compatible with standard board sizes and layouts, simplifying the integration process in electronic systems.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the DSP's reliability and robustness in extreme conditions, making it ideal for defense and aerospace applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type supports a wide range of digital signal processing tasks and applications, making the DSP a flexible and adaptive solution for various industries.

No. of Timers: 2

Having multiple timers enhances the DSP's ability to manage timing-critical tasks and applications, ensuring precise control and synchronization.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and reliable performance, making the DSP energy-efficient and optimized for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides reliable connections and facilitates easy soldering, ensuring the longevity and durability of the DSP in various operating conditions.

Nominal Supply Voltage: 1.26 V

The stable nominal supply voltage ensures consistent and reliable operation of the DSP, enhancing its overall performance and longevity.

No. of DMA Channels: 16

Having multiple DMA channels enhances the data transfer efficiency of the DSP, enabling high-speed communication with peripherals and memory devices.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for compact packaging and efficient use of space on the circuit board, making the DSP suitable for miniaturized electronic devices.

Format: FLOATING POINT

The floating-point format enables the DSP to perform complex mathematical calculations with high precision and accuracy, making it ideal for scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the DSP has a moderate sensitivity to moisture, making it suitable for applications in controlled environments where moisture levels are controlled.

Low Power Mode: YES

The low power mode feature allows the DSP to conserve energy and extend battery life, making it a suitable choice for portable and battery-operated devices.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6713BGDPM30EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SM32C6713BGDPM30EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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