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SM32C6416TGLZI1EP

Texas Instruments

SM32C6416TGLZI1EP by Texas Instruments

SM32C6416TGLZI1EP by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and 100 MHz clock frequency. Ideal for industrial applications requiring fixed-point format processing in a compact square package with bottom terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,786 parts In-Stock

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Vyrian

USA . 2,081 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 448 parts In-Stock

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$9.410

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$9.410

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Parana Technologies

USA . 648 parts In-Stock

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$17.906

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$18.075

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648

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$18.075

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DigiPath Technology Company

USA . 2,251 parts In-Stock

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$19.717

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$18.139

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$18.139

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ChromeModa Solutions

Germany . 1,882 parts In-Stock

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$20.119

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$16.498

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IDEA Electronic Components Group

UK . 47 parts In-Stock

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$20.119

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$19.113

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$18.107

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47

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$18.107

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One Stop Electronics

USA . 620 parts In-Stock

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$22.000

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$22.000

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Corohmni

South Africa . 37 parts In-Stock

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$58.522

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Corphita

USA . 4,248 parts In-Stock

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Microchip USA

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Kepictronics

USA . 108 parts In-Stock

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Overview

Unlock the power of digital signal processing with the SM32C6416TGLZI1EP by Texas Instruments. Crafted with precision and expertise, this DSP offers unparalleled performance in a variety of applications. From audio processing to telecommunications, this versatile processor delivers on reliability and efficiency. With Texas Instruments as the driving force behind this cutting-edge product, you can trust in the quality and innovation that comes with every purchase. Experience the value and benefits of superior technology with the SM32C6416TGLZI1EP and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the internal components of the DSP.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 1.24 V

This low supply voltage helps in reducing power consumption and heat dissipation.

Address Bus Width: 23

A wider address bus allows for higher memory capacity and faster data processing.

Package Shape: SQUARE

Square packages are easier to handle and provide a more uniform layout on a PCB.

Bit Size: 32

A 32-bit architecture provides higher processing capability compared to lower bit sizes.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in design and integration with other components.

No. of Terminals: 532

A high number of terminals enable connection to a wide range of external devices and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch packaging offer high density and reliability in assembly.

Minimum Supply Voltage: 1.16 V

Low minimum supply voltage ensures stability and efficiency in power management.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly.

Maximum Seated Height: 3.25 mm

Low seated height saves space and enables compact designs.

RAM Words: 16384

Large RAM capacity allows for efficient data storage and retrieval during processing.

Width: 23 mm

Compact width facilitates integration with other components in a limited space.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the DSP during production.

External Data Bus Width: 64

Wider external data bus facilitates faster data transfer between the DSP and external memory.

Maximum Clock Frequency: 100 MHz

High clock frequency supports fast data processing and real-time signal handling.

Internal Bus Architecture: MULTIPLE

Multiple internal buses enhance data transfer efficiency and parallel processing capabilities.

Length: 23 mm

Compact length allows for space-efficient PCB layout and system integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type enables connectivity with various digital devices and sensors.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

Ball terminal form simplifies soldering and ensures secure connections on the PCB.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and power efficiency.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and compact PCB design.

Format: FIXED POINT

Fixed-point format enables efficient numerical computations and processing of digital signals.

Low Power Mode: YES

Low power mode helps in reducing energy consumption during idle or low-load operation.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6416TGLZI1EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM32C6416TGLZI1EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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