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SM32C6415EGLZ50AEP

Texas Instruments

SM32C6415EGLZ50AEP by Texas Instruments

Texas Instruments SM32C6415EGLZ50AEP is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 33 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$189.217

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 92 parts In-Stock

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$189.217

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92

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$189.217

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Digiode

USA . 4,242 parts In-Stock

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4,242

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Vyrian

USA . 3,066 parts In-Stock

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3,066

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ComSIT Distribution GmbH

Germany . 114 parts In-Stock

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114

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Distributors (Availability)

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Corohmni

South Africa . 651 parts In-Stock

1+ parts

$29.465

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-

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651

$29.465

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Parana Technologies

USA . 1,572 parts In-Stock

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$63.550

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1,572

$63.550

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DigiPath Technology Company

USA . 1,293 parts In-Stock

1+ parts

$69.976

100+ parts

$64.378

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1,293

$69.976

$64.378

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ChromeModa Solutions

Germany . 5,150 parts In-Stock

1+ parts

$71.404

100+ parts

$58.551

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5,150

$71.404

$58.551

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IDEA Electronic Components Group

UK . 1,452 parts In-Stock

1+ parts

$71.404

100+ parts

$67.834

1k+ parts

$64.264

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1,452

$71.404

$67.834

$64.264

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Microchip USA

USA . 1,825 parts In-Stock

1+ parts

$290.006

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1,825

$290.006

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,250 parts In-Stock

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Kepictronics

USA . 440 parts In-Stock

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440

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Perfect Parts

USA . 213 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SM32C6415EGLZ50AEP Digital Signal Processor. Designed with precision and excellence, Texas Instruments leads the industry in delivering top-quality DSPs for a wide range of applications. Whether you're looking to enhance audio processing, improve image recognition, or streamline data analytics, this DSP offers unparalleled performance and efficiency. Experience faster processing speeds, integrated cache memory, and reliable surface mounting capabilities, all wrapped up in a compact package. Trust Texas Instruments to deliver the value and innovation you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, ensuring long-term functionality.

Integrated Cache: YES

Allows for faster data access and processing, enhancing overall performance.

Maximum Supply Voltage: 1.31 V

Ensures stability and reliability of the DSP under varied operating conditions.

Address Bus Width: 23

Supports efficient data transfer and access within the system.

Bit Size: 32

Offers a high level of processing capability and precision for complex tasks.

Power Supplies (V): 1.2,3.3

Provides flexibility in power options for different applications and environments.

No. of Terminals: 532

Allows for a greater connectivity and integration options with other components.

Minimum Supply Voltage: 1.19 V

Ensures compatibility with lower voltage requirements without sacrificing performance.

Maximum Operating Temperature: 105 °C

Can withstand high temperature environments, making it suitable for industrial applications.

No. of External Interrupts: 4

Enables efficient handling of external events or signals for responsive processing.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides good conductivity and solderability for reliable connections.

RAM Words: 16384

Offers ample memory capacity for storing and accessing data during operations.

External Data Bus Width: 64

Facilitates high-speed data transfer between the DSP and other components.

Maximum Clock Frequency: 33 MHz

Supports fast processing speeds for real-time and high-performance applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for handling digital signal processing tasks efficiently.

Technology: CMOS

Utilizes advanced CMOS technology for low power consumption and high performance.

Low Power Mode: YES

Enables energy-efficient operations, extending battery life and reducing power consumption.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6415EGLZ50AEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.31 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM32C6415EGLZ50AEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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