Loading...

SM32C6414EGLZ50AEP

Texas Instruments

SM32C6414EGLZ50AEP by Texas Instruments

The Texas Instruments SM32C6414EGLZ50AEP is a 32-bit DSP with 23-bit address bus width and 64-bit external data bus width. It operates at a max clock frequency of 33 MHz, making it ideal for industrial applications requiring high-speed signal processing in digital systems. With low power mode and boundary scan capabilities, this DSP offers efficient performance in a compact square package suitable for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,693

-

-

-

-

Digiode

USA . 3,846 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,846

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 527 parts In-Stock

1+ parts

$10.148

100+ parts

-

1k+ parts

-

10k+ parts

-

527

$10.148

-

-

-

One Stop Electronics

USA . 995 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$27.000

-

-

-

Corohmni

South Africa . 118 parts In-Stock

1+ parts

$48.402

100+ parts

-

1k+ parts

-

10k+ parts

-

118

$48.402

-

-

-

Parana Technologies

USA . 1,106 parts In-Stock

1+ parts

$62.921

100+ parts

-

1k+ parts

-

10k+ parts

-

1,106

$62.921

-

-

-

DigiPath Technology Company

USA . 1,712 parts In-Stock

1+ parts

$69.284

100+ parts

-

1k+ parts

-

10k+ parts

-

1,712

$69.284

-

-

-

ChromeModa Solutions

Germany . 777 parts In-Stock

1+ parts

$70.698

100+ parts

$57.972

1k+ parts

-

10k+ parts

-

777

$70.698

$57.972

-

-

IDEA Electronic Components Group

UK . 436 parts In-Stock

1+ parts

$70.698

100+ parts

$67.163

1k+ parts

$63.628

10k+ parts

-

436

$70.698

$67.163

$63.628

-

Corphita

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Microchip USA

USA . 369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

369

-

-

-

-

Kepictronics

USA . 310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

310

-

-

-

-

Overview

Elevate your digital signal processing capabilities with the SM32C6414EGLZ50AEP by Texas Instruments. Designed with precision and quality in mind, this DSP offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, this product provides the value, benefits, and advantages you need to stay ahead in today's competitive market. Trust in Texas Instruments' reputation for excellence and experience the difference with the SM32C6414EGLZ50AEP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.31 V

Provides a stable power supply for optimal performance without risk of damage.

Address Bus Width: 23

Wide address bus allows for efficient communication between components and data processing.

Package Shape: SQUARE

Compact square shape for efficient use of space on circuit boards.

Bit Size: 32

High bit size allows for processing of complex algorithms and data with precision.

Power Supplies (V): 1.2,3.3

Versatile power supply options for different system requirements.

No. of Terminals: 532

Ample terminals for connectivity and communication with external devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch design for secure and reliable connection on circuit boards.

Minimum Supply Voltage: 1.19 V

Low minimum supply voltage for efficient power management and energy savings.

Maximum Operating Temperature: 105 °C

High operating temperature range suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in various environments.

Terminal Finish: TIN LEAD

Tin lead finish for reliable connections and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position for easy installation and maintenance.

Maximum Seated Height: 3.3 mm

Low seated height for compact design and integration in slim devices.

RAM Words: 16384

Ample RAM capacity for storing and accessing data during processing.

Width: 23 mm

Compact width for space-efficient design in electronic systems.

Boundary Scan: YES

Boundary scan feature for testing and debugging during product development.

External Data Bus Width: 64

Wide external data bus width for high-speed data transfer and processing.

Maximum Clock Frequency: 33 MHz

High clock frequency for efficient data processing and performance.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time for efficient manufacturing process and component assembly.

Peak Reflow Temperature °C: 220

High peak reflow temperature for secure soldering and component bonding.

Internal Bus Architecture: MULTIPLE

Multiple internal buses for parallel processing and efficient data flow.

Length: 23 mm

Compact length for space-saving design in electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type for optimized digital signal processing and additional functionalities.

Technology: CMOS

CMOS technology for low power consumption and high integration in electronic circuits.

Terminal Form: BALL

Ball terminal form for secure and reliable connections on circuit boards.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage for consistent performance and reliability.

Terminal Pitch: 0.8 mm

Fine terminal pitch for precise connections and space-saving design.

Format: FIXED POINT

Fixed-point format for accurate numerical computations and signal processing.

Moisture Sensitivity Level (MSL): 4

MSL level 4 for safe handling and storage to prevent moisture damage.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6414EGLZ50AEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.31 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM32C6414EGLZ50AEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20