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SM320VC5409GGU10EP

Texas Instruments

SM320VC5409GGU10EP by Texas Instruments

Texas Instruments SM320VC5409GGU10EP is a 16-bit DSP with 23-bit address bus, operating at max 20MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and 32768 RAM words for efficient signal processing. With a compact square package and grid array style, it offers high performance in a small form factor.

Median Price

$16.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 189 parts In-Stock

1+ parts

-

100+ parts

$14.500

1k+ parts

$12.970

10k+ parts

$12.210

189

-

$14.500

$12.970

$12.210

DigiKey

USA . 189 parts In-Stock

1+ parts

-

100+ parts

$16.750

1k+ parts

-

10k+ parts

-

189

-

$16.750

-

-

Verical

USA . 189 parts In-Stock

1+ parts

-

100+ parts

$18.125

1k+ parts

$16.212

10k+ parts

$15.262

189

-

$18.125

$16.212

$15.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,926 parts In-Stock

1+ parts

$15.304

100+ parts

-

1k+ parts

-

10k+ parts

-

4,926

$15.304

-

-

-

Vyrian

USA . 4,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,954

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 189 parts In-Stock

1+ parts

$13.690

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$13.690

-

-

-

Semicontronic

India . 14 parts In-Stock

1+ parts

$13.690

100+ parts

$13.348

1k+ parts

$13.279

10k+ parts

-

14

$13.690

$13.348

$13.279

-

Corphita

USA . 479 parts In-Stock

1+ parts

$14.499

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$14.499

-

-

-

Advanced Electronics

New Zealand . 1,200 parts In-Stock

1+ parts

$34.069

100+ parts

$33.729

1k+ parts

$32.366

10k+ parts

-

1,200

$34.069

$33.729

$32.366

-

Parana Technologies

USA . 1,370 parts In-Stock

1+ parts

$37.208

100+ parts

-

1k+ parts

-

10k+ parts

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1,370

$37.208

-

-

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DigiPath Technology Company

USA . 1,207 parts In-Stock

1+ parts

$40.971

100+ parts

-

1k+ parts

-

10k+ parts

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1,207

$40.971

-

-

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ChromeModa Solutions

Germany . 5,749 parts In-Stock

1+ parts

$41.807

100+ parts

$34.282

1k+ parts

-

10k+ parts

-

5,749

$41.807

$34.282

-

-

IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$41.807

100+ parts

$39.717

1k+ parts

$37.626

10k+ parts

-

712

$41.807

$39.717

$37.626

-

Corohmni

South Africa . 2,220 parts In-Stock

1+ parts

$73.891

100+ parts

-

1k+ parts

-

10k+ parts

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2,220

$73.891

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Microchip USA

USA . 261 parts In-Stock

1+ parts

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261

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Perfect Parts

USA . 119 parts In-Stock

1+ parts

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119

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Overview

Unlock the power of cutting-edge technology with the SM320VC5409GGU10EP by Texas Instruments. As a leading manufacturer in digital signal processors (DSPs), Texas Instruments brings unparalleled quality and expertise to this product. Ideal for a wide range of applications, this DSP offers customers exceptional value, performance, and reliability. Experience seamless operation and superior functionality with the SM320VC5409GGU10EP, setting new standards in innovation and efficiency. Elevate your projects with the best-in-class solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easier to handle and less expensive to produce.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of electronic components, making the product suitable for modern manufacturing processes.

Maximum Supply Voltage: 1.98 V

The high maximum supply voltage allows for versatility in powering the device, accommodating a wide range of power sources.

Address Bus Width: 23

A wider address bus width allows for more memory addressability, enabling the processor to handle larger and more complex data sets efficiently.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on circuit boards, optimizing the use of available real estate.

Bit Size: 16

A 16-bit architecture enables the processor to handle data in larger chunks, leading to improved performance and processing speed.

Power Supplies (V): 1.8,3.3

Having multiple power supply options allows for flexibility in design and compatibility with a variety of power sources.

No. of Terminals: 144

Having a high number of terminals provides ample connectivity options, allowing for integration with various other electronic components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and efficient design, making the product suitable for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and extends the operating range of the processor.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows the processor to withstand harsh environmental conditions, enhancing its reliability and durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the processor can function effectively even in cold environments.

Terminal Finish: TIN LEAD

A tin lead finish provides good solderability and ensures a reliable connection between the processor and the circuit board.

Terminal Position: BOTTOM

Having terminals positioned at the bottom of the package simplifies the assembly process and allows for convenient mounting on the circuit board.

Maximum Seated Height: 1.4 mm

The low maximum seated height enables the processor to be used in slim devices without compromising on performance.

RAM Words: 32768

With a large amount of RAM words, the processor can store and manipulate a significant amount of data, enhancing its processing capabilities.

Width: 12 mm

A compact width allows the processor to be easily integrated into various electronic devices without taking up a lot of space.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the processor, ensuring high quality and reliability of the final product.

External Data Bus Width: 16

A wide external data bus width enables fast data transfer between the processor and external components, improving overall system performance.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency allows the processor to execute instructions quickly and efficiently, leading to faster processing speeds.

Maximum Time At Peak Reflow Temperature (s): 20

This specification indicates the processor's capability to withstand high temperatures during the reflow soldering process, ensuring reliable assembly.

Peak Reflow Temperature °C: 220

A high peak reflow temperature tolerance ensures that the processor can withstand the thermal stress of the soldering process without damaging its components.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and allows for efficient communication between different components of the processor.

Length: 12 mm

A compact length makes the processor suitable for integration into small electronic devices, maximizing space utilization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the processor can operate reliably in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor allows the product to efficiently process and manipulate digital signals, making it suitable for applications such as audio processing or communications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminals enable easy and reliable connection between the processor and the circuit board, ensuring smooth operation and longevity of the product.

Nominal Supply Voltage: 1.8 V

A stable nominal supply voltage ensures consistent and reliable operation of the processor, reducing the risk of malfunctions or errors.

Terminal Pitch: 0.8 mm

A small terminal pitch allows for densely packed terminals, enabling more connectivity options in a limited space.

Format: FIXED POINT

Being a fixed-point format processor allows for efficient and accurate integer arithmetic calculations, making it suitable for applications that require precise computation.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates moderate sensitivity to moisture, necessitating proper handling and storage to prevent damage during assembly.

Low Power Mode: YES

The low power mode feature allows the processor to operate with reduced power consumption, prolonging battery life and making it suitable for portable devices.

Barrel Shifter: YES

A barrel shifter allows for efficient shifting and rotation operations on binary data, enabling faster processing and better performance in certain computations.

Technical Specifications

Digital Signal Processors (DSPs) SM320VC5409GGU10EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

SM320VC5409GGU10EP Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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