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SM320F2812HFGM150

Texas Instruments

SM320F2812HFGM150 by Texas Instruments

Texas Instruments SM320F2812HFGM150 is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data RAM width. Ideal for military applications due to its MIL-TEMP grade, FLASH ROM programmability, and low power mode for efficient operation in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,677 parts In-Stock

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6,677

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Digiode

USA . 300 parts In-Stock

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300

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,340 parts In-Stock

1+ parts

$3.000

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1,340

$3.000

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One Stop Electronics

USA . 807 parts In-Stock

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$8.000

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807

$8.000

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AZTECH Wire

Italy . 706 parts In-Stock

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$11.802

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706

$11.802

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Parana Technologies

USA . 2,184 parts In-Stock

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$25.716

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$26.318

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2,184

$25.716

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$26.318

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DigiPath Technology Company

USA . 268 parts In-Stock

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$28.316

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268

$28.316

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ChromeModa Solutions

Germany . 6,448 parts In-Stock

1+ parts

$28.894

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$23.693

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6,448

$28.894

$23.693

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$28.894

100+ parts

$27.449

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$26.005

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1,473

$28.894

$27.449

$26.005

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Corohmni

South Africa . 1,959 parts In-Stock

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$48.311

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Kepictronics

USA . 3,000 parts In-Stock

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Microchip USA

USA . 1,918 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 787 parts In-Stock

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787

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unleash the power of cutting-edge technology with the SM320F2812HFGM150 by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments delivers unparalleled quality and reliability. This versatile product is perfect for a wide range of applications, providing customers with exceptional value and performance. Experience the advantages of advanced features and innovative design that this product offers, setting new standards in the industry. Elevate your projects to new heights with the SM320F2812HFGM150 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the internal components of the DSP, ensuring longevity and reliability.

Maximum Supply Voltage: 2 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of systems.

RAM Words: 18432

The large RAM capacity allows for efficient data storage and processing, enabling the DSP to handle complex tasks effectively.

Maximum Clock Frequency: 150 MHz

The high clock frequency enables fast data processing and execution of instructions, making the DSP suitable for real-time applications.

Package Style (Meter): FLATPACK, GUARD RING

The flatpack design with guard ring enhances thermal conductivity and provides effective heat dissipation, ensuring optimal performance under high workload conditions.

Technical Specifications

Digital Signal Processors (DSPs) SM320F2812HFGM150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V SUPPLY

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQFP-F172

JESD-609 Code:

e4

Length:

29.085 mm

Low Power Mode:

YES

No. of External Interrupts:

3

No. of Terminals:

172

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

TPAK172,2.5SQ,25

Package Shape:

Package Style (Meter):

FLATPACK, GUARD RING

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

29.085 mm

Peripheral IC Type:

Trade Compliance

SM320F2812HFGM150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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