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SM320C50PQM66EP

Texas Instruments

SM320C50PQM66EP by Texas Instruments

The Texas Instruments SM320C50PQM66EP is a 16-bit DSP with 1056 RAM words, operating at 66 MHz. Ideal for military applications due to its temperature grade and low power mode. Features include a max supply voltage of 5.25 V and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,159 parts In-Stock

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Digiode

USA . 2,492 parts In-Stock

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2,492

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Distributors (Availability)

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AZTECH Wire

Italy . 784 parts In-Stock

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$14.177

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784

$14.177

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$14.495

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$13.190

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$11.886

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150

$14.495

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$11.886

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One Stop Electronics

USA . 783 parts In-Stock

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$35.000

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783

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Parana Technologies

USA . 1,712 parts In-Stock

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$61.957

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$5,753.680

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$55.762

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1,712

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$55.762

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DigiPath Technology Company

USA . 51 parts In-Stock

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$68.223

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51

$68.223

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IDEA Electronic Components Group

UK . 663 parts In-Stock

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$69.615

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$66.134

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$62.654

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663

$69.615

$66.134

$62.654

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ChromeModa Solutions

Germany . 414 parts In-Stock

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$69.615

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$57.084

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414

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Corohmni

South Africa . 1,978 parts In-Stock

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$75.108

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Component Stockers USA

USA . 534 parts In-Stock

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$99.990

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Corphita

USA . 1,536 parts In-Stock

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Kepictronics

USA . 400 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SM320C50PQM66EP Digital Signal Processor. Built to deliver unparalleled performance and reliability, this DSP stands out in its category for its superior quality and precision engineering. From military-grade applications to industrial automation, this processor excels in a wide range of environments, providing customers with unmatched value and flexibility. Trust Texas Instruments to bring you the best in digital signal processing technology, and experience the difference with the SM320C50PQM66EP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier assembly and smaller form factor, saving space in electronic designs.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power supply options and operation.

Bit Size: 16

16-bit processing capability allows for handling complex digital signals with precision and accuracy.

No. of Terminals: 132

Higher number of terminals offer more connection options and versatility in system integration.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability in various environmental conditions.

RAM Words: 1056

Ample RAM capacity allows for efficient data processing and storage in the digital signal processor.

Maximum Clock Frequency: 66 MHz

High clock frequency enables fast data processing and real-time signal handling capabilities.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed as a digital signal processor, providing specialized functionality for signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) SM320C50PQM66EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

7

No. of External Interrupts:

4

No. of Terminals:

132

No. of Timers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SQFP132,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1056

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

225 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

SM320C50PQM66EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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