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SM320C31GFAM50

Texas Instruments

SM320C31GFAM50 by Texas Instruments

Texas Instruments SM320C31GFAM50 is a 32-bit DSP with 5V supply, 50MHz clock frequency, and 2K RAM words. Ideal for military applications due to its -55 to 125 °C operating temperature range and low power mode. Features include a barrel shifter, multiple internal bus architecture, and floating-point format.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,482 parts In-Stock

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Digiode

USA . 4,942 parts In-Stock

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4,942

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Distributors (Availability)

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AZTECH Wire

Italy . 642 parts In-Stock

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$11.629

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642

$11.629

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Ampacity Inc.

Singapore . 669 parts In-Stock

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$30.000

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669

$30.000

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One Stop Electronics

USA . 1,197 parts In-Stock

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$35.000

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$35.000

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Parana Technologies

USA . 1,509 parts In-Stock

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$39.988

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1,509

$39.988

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DigiPath Technology Company

USA . 1,213 parts In-Stock

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$44.031

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$40.509

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$44.031

$40.509

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ChromeModa Solutions

Germany . 2,468 parts In-Stock

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$44.930

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$36.843

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2,468

$44.930

$36.843

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IDEA Electronic Components Group

UK . 1,461 parts In-Stock

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$44.930

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$42.684

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$40.437

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1,461

$44.930

$42.684

$40.437

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Corohmni

South Africa . 8 parts In-Stock

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$57.043

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Corphita

USA . 2,636 parts In-Stock

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Microchip USA

USA . 1,819 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SM320C31GFAM50 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are ideal for a wide range of applications. From audio processing to telecommunications, this DSP offers unparalleled performance and reliability. Experience the value of advanced features such as low power mode and barrel shifter, providing you with efficient and seamless operation. Invest in the future of technology with the SM320C31GFAM50 and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and resistance to high temperatures, making this product suitable for harsh environments.

Maximum Supply Voltage: 5.25 V

With a maximum supply voltage of 5.25 V, this product can handle higher voltage inputs without risk of damage, making it versatile for various applications.

Bit Size: 32

The 32-bit architecture of this product allows for efficient processing of data and complex algorithms, making it ideal for handling advanced signal processing tasks.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz ensures fast processing speed and real-time operation, making this product suitable for demanding signal processing applications.

Temperature Grade: MILITARY

Designed for military-grade applications, this product meets strict reliability and performance standards, making it a reliable choice for mission-critical tasks in challenging environments.

Low Power Mode: YES

The availability of a low power mode helps in optimizing power consumption, extending battery life, and reducing operating costs in portable or battery-powered applications.

Technical Specifications

Digital Signal Processors (DSPs) SM320C31GFAM50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P141

Length:

26.925 mm

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

1

No. of Terminals:

141

No. of Timers:

2

On Chip Data RAM Width:

32

On Chip Program ROM Width:

0

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

SPGA141,19X19

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2K

Maximum Seated Height:

5.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

26.925 mm

Peripheral IC Type:

Trade Compliance

SM320C31GFAM50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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