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OMAPL138BZWTD4E

Texas Instruments

OMAPL138BZWTD4E by Texas Instruments

The Texas Instruments OMAPL138BZWTD4E is a DSP with 361 terminals, operating at up to 50 MHz. It features low power mode and floating point format, suitable for industrial applications requiring high-speed signal processing in a compact package. With a wide temperature range of -40 to 90°C, it offers versatility for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,325 parts In-Stock

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Digiode

USA . 2,524 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 395 parts In-Stock

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$9.690

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395

$9.690

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Ampacity Inc.

Singapore . 521 parts In-Stock

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$33.000

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One Stop Electronics

USA . 584 parts In-Stock

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$34.000

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Parana Technologies

USA . 2,374 parts In-Stock

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$54.212

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DigiPath Technology Company

USA . 641 parts In-Stock

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$59.694

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$54.918

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641

$59.694

$54.918

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ChromeModa Solutions

Germany . 4,063 parts In-Stock

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$60.912

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$49.948

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$60.912

$49.948

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IDEA Electronic Components Group

UK . 210 parts In-Stock

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$60.912

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$57.866

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$54.821

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210

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$54.821

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Corohmni

South Africa . 3,174 parts In-Stock

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$84.022

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Component Stockers USA

USA . 554 parts In-Stock

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$99.990

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Lixinc

USA . 6,782 parts In-Stock

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Corphita

USA . 4,789 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Perfect Parts

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Microchip USA

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Futuretech Components

Singapore . 124 parts In-Stock

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Infinite Electronics LLP (Excess)

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Overview

Unleash the power of cutting-edge technology with the OMAPL138BZWTD4E by Texas Instruments! As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers. Experience seamless performance and innovation with the OMAPL138BZWTD4E - your ultimate solution for all your digital signal processing needs. Elevate your projects with this versatile and high-performance DSP - get yours today and revolutionize your work!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy material for the package body provides durability and protection to the internal components of the DSP, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable makes the DSP easy to integrate into circuit boards, reducing assembly time and allowing for compact design layouts.

Maximum Supply Voltage: 1.35 V

The low maximum supply voltage requirement helps in minimizing power consumption and heat generation, making the DSP energy-efficient.

Package Shape: SQUARE

The square package shape enables efficient use of board space and simplifies routing of connections, enhancing overall system integration.

Power Supplies (V): 1.2, 1.8/3.3

Having multiple voltage options allows for flexibility in power supply configurations, catering to different system requirements and voltage compatibility.

No. of Terminals: 361

With a high number of terminals, the DSP provides ample connectivity options for interfacing with external components and peripherals, expanding its functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and efficient signal routing capabilities, ideal for space-constrained applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, enhancing versatility and ease of integration.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can withstand demanding environmental conditions and maintain stable performance in a wide range of operating environments.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows the DSP to function reliably in extreme cold conditions, increasing its suitability for diverse applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring robust connections and long-term reliability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and assembly, enabling easier access and efficient routing of connections in the system design.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for a compact and slim profile, facilitating space-saving designs and enabling integration into tight enclosure spaces.

Width: 16 mm

The compact width of the DSP promotes space-efficient board layouts and allows for versatile placement within systems, optimizing overall design flexibility.

Boundary Scan: YES

The inclusion of boundary scan capability enables efficient testing and debugging of the DSP during production, ensuring high quality and reliability of the final product.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency, the DSP can handle complex signal processing tasks quickly and efficiently, delivering optimal performance in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature provides guidelines for proper soldering processes, ensuring reliable and consistent solder joints during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering processes and compatibility with lead-free assembly requirements, ensuring mechanical integrity.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architectures enhances data throughput and enables parallel processing capabilities, improving overall performance and efficiency of the DSP.

Length: 16 mm

The compact length of the DSP enables space-efficient board layouts and facilitates easy integration into various system designs, enhancing overall flexibility and usability.

Temperature Grade: INDUSTRIAL

Featuring an industrial temperature grade ensures reliable operation in harsh industrial environments, making the DSP suitable for rugged applications and extended use.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral IC types enhances the DSP's versatility and functionality, enabling a wider range of signal processing capabilities and applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making the DSP energy-efficient and reliable in operation.

Terminal Form: BALL

The ball terminal form provides reliable solder connections and facilitates automated assembly processes, ensuring consistent quality and performance in mass production.

Nominal Supply Voltage: 1 V

Having a stable nominal supply voltage simplifies power management and ensures consistent performance, making the DSP easy to integrate and operate in various systems.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density PCB layouts and enables compact system designs, maximizing space utilization and enhancing overall system efficiency.

Format: FLOATING POINT

Featuring floating-point format enables high precision and accuracy in mathematical computations, making the DSP suitable for demanding signal processing tasks and complex algorithms.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the DSP is suitable for standard soldering processes and storage conditions, ensuring reliability and performance in typical operating environments.

Low Power Mode: YES

The inclusion of a low power mode allows the DSP to operate efficiently at reduced power levels, extending battery life and promoting energy-saving operation in portable devices or power-constrained applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZWTD4E attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZWTD4E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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