Loading...

OMAPL138BZCEA3R

Texas Instruments

OMAPL138BZCEA3R by Texas Instruments

OMAPL138BZCEA3R by Texas Instruments is a DSP with 16-bit external data bus, 23-bit address bus width, and max clock frequency of 30 MHz. It is used in applications requiring low power mode, such as digital signal processing tasks in various electronic devices.

Median Price

$28.100

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

$28.100

100+ parts

$27.540

1k+ parts

$26.980

10k+ parts

-

1,000

$28.100

$27.540

$26.980

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,536 parts In-Stock

1+ parts

$26.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,536

$26.695

-

-

-

Vyrian

USA . 7,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,603

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$10.460

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$10.460

-

-

-

Ampacity Inc.

Singapore . 948 parts In-Stock

1+ parts

$23.890

100+ parts

-

1k+ parts

-

10k+ parts

-

948

$23.890

-

-

-

Corphita

USA . 1,135 parts In-Stock

1+ parts

$25.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

$25.290

-

-

-

Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

$26.010

100+ parts

-

1k+ parts

$26.604

10k+ parts

-

1,361

$26.010

-

$26.604

-

DigiPath Technology Company

USA . 1,823 parts In-Stock

1+ parts

$28.640

100+ parts

$26.349

1k+ parts

-

10k+ parts

-

1,823

$28.640

$26.349

-

-

IDEA Electronic Components Group

UK . 1,483 parts In-Stock

1+ parts

$29.225

100+ parts

$27.764

1k+ parts

$26.302

10k+ parts

-

1,483

$29.225

$27.764

$26.302

-

ChromeModa Solutions

Germany . 849 parts In-Stock

1+ parts

$29.225

100+ parts

$23.964

1k+ parts

-

10k+ parts

-

849

$29.225

$23.964

-

-

Corohmni

South Africa . 2,598 parts In-Stock

1+ parts

$83.869

100+ parts

-

1k+ parts

-

10k+ parts

-

2,598

$83.869

-

-

-

Microchip USA

USA . 4,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,348

-

-

-

-

Overview

Elevate your digital signal processing capabilities with the OMAPL138BZCEA3R from Texas Instruments. This high-quality DSP offers unparalleled performance and reliability, making it perfect for a wide range of applications. With its advanced technology and innovative design, this product provides exceptional value and benefits to customers seeking cutting-edge solutions. Unlock new possibilities and enhance your projects with the OMAPL138BZCEA3R - the ultimate choice for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on printed circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage provides ample power for the DSP to perform complex signal processing tasks efficiently.

Address Bus Width: 23

The wide address bus width allows for efficient data processing and handling of large memory addresses.

Package Shape: SQUARE

The square shape of the package allows for easy and compact placement on PCBs, optimizing space utilization.

Power Supplies (V): 1.2,1.8/3.3

The multiple power supply options provide flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 361

The high number of terminals allows for a wide range of connections and interfaces, enhancing the versatility of the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient heat dissipation, compact design, and high reliability.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for efficient power consumption and extends battery life in portable applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB mounting and soldering processes.

Maximum Seated Height: 1.3 mm

The low seated height minimizes the overall profile of the product, making it suitable for compact device designs.

Width: 13 mm

The compact width allows for easy integration into various electronic devices without occupying excessive space.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the DSP during production and maintenance processes.

External Data Bus Width: 16

The external data bus width of 16 bits allows for fast and efficient data transfer between the DSP and external memory or peripherals.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency enables the DSP to process signals at a fast and efficient rate, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures that the DSP is not subjected to excessive heat, preventing damage during soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable and robust solder joints, ensuring the longevity and performance of the DSP.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies the design and operation of the DSP, improving overall efficiency and performance.

Length: 13 mm

The compact length of the DSP makes it suitable for integration into various electronic devices with space constraints.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type allows the DSP to interface with a wide range of external devices and systems, enhancing its functionality.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and compatibility with various electronic systems, making the DSP energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable and robust connections, ensuring stable electrical performance in demanding environments.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage for the DSP, ensuring consistent performance and reliability.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting of the DSP on PCBs, optimizing space utilization and improving connectivity.

Format: FLOATING POINT

The floating-point format enables the DSP to perform complex mathematical calculations with increased precision and accuracy, enhancing its signal processing capabilities.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, ensuring that the DSP can withstand standard storage and handling conditions without degradation.

Low Power Mode: YES

The low power mode option allows the DSP to conserve energy when not operating at full capacity, extending battery life and reducing power consumption.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZCEA3R attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZCEA3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20