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OMAPL138BZCEA3

Texas Instruments

OMAPL138BZCEA3 by Texas Instruments

The Texas Instruments OMAPL138BZCEA3 is a DSP with 361 terminals, operating at up to 50 MHz. It features low power mode and boundary scan capabilities, suitable for industrial applications requiring a max temperature of 105°C. With a package style of grid array and fine pitch, it offers advanced CMOS technology in a compact square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,602 parts In-Stock

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Digiode

USA . 4,525 parts In-Stock

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Inventory MP

USA . 113 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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One Stop Electronics

USA . 931 parts In-Stock

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$7.000

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931

$7.000

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AZTECH Wire

Italy . 226 parts In-Stock

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$12.407

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Ampacity Inc.

Singapore . 1,513 parts In-Stock

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$14.000

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Parana Technologies

USA . 730 parts In-Stock

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$24.894

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$25.588

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730

$24.894

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$25.588

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ChromeModa Solutions

Germany . 5,779 parts In-Stock

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$27.971

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$22.936

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$22.936

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IDEA Electronic Components Group

UK . 1,713 parts In-Stock

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$27.971

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$26.572

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$25.174

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$26.572

$25.174

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Corohmni

South Africa . 21 parts In-Stock

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$68.737

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Microchip USA

USA . 5,772 parts In-Stock

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 1,848 parts In-Stock

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$25.219

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Corphita

USA . 546 parts In-Stock

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Kepictronics

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the OMAPL138BZCEA3 by Texas Instruments. As a leading manufacturer of Digital Signal Processors, Texas Instruments delivers unmatched quality and reliability in every product. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency. Experience seamless integration, enhanced functionality, and superior processing capabilities with the OMAPL138BZCEA3. Elevate your projects to new heights and stay ahead of the competition with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for portable and rugged use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and making assembly quicker.

Maximum Supply Voltage: 1.35 V

The maximum supply voltage of 1.35 V ensures efficient power consumption and operation of the DSP.

Package Shape: SQUARE

The square package shape is easy to handle and provides a uniform footprint for standardized PCB layouts.

Power Supplies (V): 1.2,1.8/3.3

Support for multiple power supply voltages allows for versatile compatibility with different systems and power sources.

No. of Terminals: 361

The high number of terminals provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style facilitates high-density mounting on PCBs, saving space and enabling compact designs.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95 V allows for efficient operation at lower power levels, minimizing energy consumption.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even under extreme thermal conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature from -40°C allows for operation in various environmental conditions, from freezing to high heat.

Terminal Finish: TIN SILVER COPPER

The use of tin-silver-copper terminal finish provides good electrical conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position makes the product suitable for automated assembly processes and enhances thermal management in PCB layouts.

Maximum Seated Height: 1.3 mm

The low maximum seated height of 1.3 mm allows for a slim profile and compact placement in space-constrained applications.

Width: 13 mm

The narrow width of 13 mm enables efficient use of board space and allows for closer component placement for optimized circuit layout.

Boundary Scan: YES

The boundary scan feature facilitates testing and debugging of the DSP during manufacturing and maintenance, ensuring product quality and reliability.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz enables fast signal processing and responsiveness, making the product suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow during assembly, leading to consistent and reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables reliable and consistent soldering of the DSP to the PCB, ensuring stable electrical connections.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer speeds and efficiency within the DSP, improving overall processing performance.

Length: 13 mm

The compact length of 13 mm allows for space-saving integration into small-sized electronic devices and systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the versatility and compatibility of the DSP with different signal processing and communication protocols.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noise-sensitive applications.

Terminal Form: BALL

The ball terminal form provides reliable solder connections and easy reworkability, ensuring robust electrical connections and ease of maintenance.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides stable power delivery for consistent and reliable operation of the DSP.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and compact PCB designs, optimizing space efficiency in electronic systems.

Format: FLOATING POINT

Support for floating-point format enables high precision and accuracy in numeric calculations and processing tasks, making the DSP suitable for complex algorithms and computations.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring standard precautions to prevent damage.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation and extends battery life in portable devices, making the product environmentally friendly and cost-effective.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZCEA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZCEA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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