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OMAPL137DZKBA3

Texas Instruments

OMAPL137DZKBA3 by Texas Instruments

OMAPL137DZKBA3 by Texas Instruments is a DSP with integrated cache, 8-bit data RAM, and 15-bit address bus. It operates at a max clock frequency of 30 MHz and has 499712 RAM words. Ideal for industrial applications requiring high-speed processing in compact form factors.

Median Price

$31.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,668 parts In-Stock

1+ parts

$20.358

100+ parts

$18.096

1k+ parts

$13.306

10k+ parts

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1,668

$20.358

$18.096

$13.306

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Mouser Electronics

USA . 203 parts In-Stock

1+ parts

$31.140

100+ parts

$22.190

1k+ parts

$21.250

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203

$31.140

$22.190

$21.250

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DigiKey

USA . 86 parts In-Stock

1+ parts

$31.140

100+ parts

$22.192

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$21.255

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86

$31.140

$22.192

$21.255

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Distributors (In-Stock)

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Digiode

USA . 775 parts In-Stock

1+ parts

$19.340

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-

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775

$19.340

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Vyrian

USA . 5,679 parts In-Stock

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5,679

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LIBRA Elektronik GmbH

Germany . 5 parts In-Stock

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5

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Distributors (Availability)

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Corphita

USA . 1,365 parts In-Stock

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$18.322

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$18.322

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Corohmni

South Africa . 3,006 parts In-Stock

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$22.035

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3,006

$22.035

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Parana Technologies

USA . 1,622 parts In-Stock

1+ parts

$63.628

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1,622

$63.628

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DigiPath Technology Company

USA . 1,729 parts In-Stock

1+ parts

$70.062

100+ parts

$64.457

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1,729

$70.062

$64.457

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ChromeModa Solutions

Germany . 2,118 parts In-Stock

1+ parts

$71.492

100+ parts

$58.623

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2,118

$71.492

$58.623

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IDEA Electronic Components Group

UK . 576 parts In-Stock

1+ parts

$71.492

100+ parts

$67.917

1k+ parts

$64.343

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576

$71.492

$67.917

$64.343

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Lixinc

USA . 824 parts In-Stock

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824

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A-Z Elektronik GmbH

Germany . 135 parts In-Stock

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135

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Kepictronics

USA . 90 parts In-Stock

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90

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments OMAPL137DZKBA3 Digital Signal Processor. Designed with precision and expertise, this processor offers unparalleled performance and reliability for a wide range of applications. Whether you're in need of high-speed data processing or complex signal analysis, this DSP delivers exceptional results every time. With advanced features like integrated cache and low power mode, you can trust that your projects will run smoothly and efficiently. Elevate your work to the next level with the OMAPL137DZKBA3 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and chemical resistance, making the product suitable for a variety of environments.

Integrated Cache: YES

The integrated cache helps in faster processing and data retrieval, enhancing overall performance.

Maximum Supply Voltage: 1.32 V

Operates efficiently within the specified voltage range, ensuring stable performance.

Address Bus Width: 15

The wide address bus allows for efficient memory addressing, enhancing data processing capabilities.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier installation and maintenance of the product.

Maximum Clock Frequency: 30 MHz

High clock frequency enables fast signal processing, making this product ideal for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137DZKBA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

3

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

499712

Maximum Seated Height:

2.05 mm

Speed:

456 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137DZKBA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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