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OMAPL137CZKB3

Texas Instruments

OMAPL137CZKB3 by Texas Instruments

OMAPL137CZKB3 by Texas Instruments is a DSP with 256 terminals, operating at temperatures from 0 to 70°C. It features power supplies of 1.2V and 1.8/3.3V, suitable for commercial-grade applications requiring a CMOS technology-based digital signal processor in a square package shape with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,104 parts In-Stock

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Digiode

USA . 442 parts In-Stock

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442

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One Stop Electronics

USA . 458 parts In-Stock

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$2.000

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458

$2.000

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AZTECH Wire

Italy . 596 parts In-Stock

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$15.953

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596

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Corohmni

South Africa . 2,144 parts In-Stock

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$47.647

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Parana Technologies

USA . 1,972 parts In-Stock

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$55.945

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$5,195.296

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$50.350

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1,972

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DigiPath Technology Company

USA . 2,204 parts In-Stock

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$61.602

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ChromeModa Solutions

Germany . 4,630 parts In-Stock

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$62.859

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$51.544

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$62.859

$51.544

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

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$62.859

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$59.716

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$56.573

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Component Stockers USA

USA . 310 parts In-Stock

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$99.990

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Corphita

USA . 4,562 parts In-Stock

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Microchip USA

USA . 180 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the OMAPL137CZKB3 by Texas Instruments, a top-tier manufacturer renowned for excellence in digital signal processors (DSPs). This versatile product offers unmatched performance and reliability, making it ideal for a wide range of applications. From audio processing to telecommunications, this DSP delivers exceptional value, benefits, and advantages that cater to the diverse needs of customers. Experience seamless operation and unparalleled efficiency with the OMAPL137CZKB3, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material suitable for electronic components, making the product sturdy and long-lasting.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 1.2,1.8/3.3

Flexible power supply options cater to different voltage requirements, providing versatility in various applications.

No. of Terminals: 256

Ample number of terminals allow for connectivity with multiple external devices, enhancing the product's connectivity capabilities.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and improved electrical connections, ensuring efficient operation of the product.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function even in cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Multiple terminal finish options provide corrosion resistance and excellent conductivity, ensuring stable and efficient electrical connections.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product is suitable for standard operating conditions in commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product can withstand exposure to moderate humidity levels, ensuring durability in various environmental conditions.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137CZKB3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

OMAPL137CZKB3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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