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OMAP5912ZZG

Texas Instruments

OMAP5912ZZG by Texas Instruments

OMAP5912ZZG by Texas Instruments is a 16-bit DSP with integrated cache, 163840 RAM words, and 19.2 MHz clock frequency. Ideal for industrial applications requiring low power consumption and high processing speeds. Features include 26-bit address bus width, 1.525-1.65V supply voltage range, and boundary scan capability for efficient testing.

Median Price

$42.559

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 418 parts In-Stock

1+ parts

-

100+ parts

$37.830

1k+ parts

$33.850

10k+ parts

$31.860

418

-

$37.830

$33.850

$31.860

Verical

USA . 242 parts In-Stock

1+ parts

-

100+ parts

$47.288

1k+ parts

$42.313

10k+ parts

$39.825

242

-

$47.288

$42.313

$39.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,443 parts In-Stock

1+ parts

$39.928

100+ parts

-

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-

10k+ parts

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3,443

$39.928

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-

-

Vyrian

USA . 6,317 parts In-Stock

1+ parts

-

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-

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6,317

-

-

-

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Prism Electronics

USA . 129 parts In-Stock

1+ parts

-

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129

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Q Components

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 442 parts In-Stock

1+ parts

$37.827

100+ parts

-

1k+ parts

-

10k+ parts

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442

$37.827

-

-

-

Corohmni

South Africa . 1,011 parts In-Stock

1+ parts

$57.225

100+ parts

-

1k+ parts

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10k+ parts

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1,011

$57.225

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Parana Technologies

USA . 1,475 parts In-Stock

1+ parts

$75.039

100+ parts

-

1k+ parts

-

10k+ parts

-

1,475

$75.039

-

-

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DigiPath Technology Company

USA . 1,137 parts In-Stock

1+ parts

$82.627

100+ parts

-

1k+ parts

-

10k+ parts

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1,137

$82.627

-

-

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ChromeModa Solutions

Germany . 5,290 parts In-Stock

1+ parts

$84.313

100+ parts

$69.137

1k+ parts

-

10k+ parts

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5,290

$84.313

$69.137

-

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IDEA Electronic Components Group

UK . 1,165 parts In-Stock

1+ parts

$84.313

100+ parts

$80.097

1k+ parts

$75.882

10k+ parts

-

1,165

$84.313

$80.097

$75.882

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Microchip USA

USA . 493 parts In-Stock

1+ parts

$100.530

100+ parts

$98.780

1k+ parts

$97.910

10k+ parts

$97.040

493

$100.530

$98.780

$97.910

$97.040

Kepictronics

USA . 24,510 parts In-Stock

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24,510

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Perfect Parts

USA . 344 parts In-Stock

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344

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Overview

Experience the cutting-edge technology of the Texas Instruments OMAP5912ZZG Digital Signal Processor. With a focus on quality and innovation, Texas Instruments delivers top-of-the-line products that exceed industry standards. The OMAP5912ZZG is a versatile solution for a variety of applications in sectors such as telecommunications, automotive, and consumer electronics. Offering unmatched value, performance, and reliability, this DSP provides customers with the competitive edge they need to succeed in today's fast-paced market. Trust Texas Instruments to deliver the best in class digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Having integrated cache allows for faster processing speed and better performance in handling complex digital signal processing tasks.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 26

With a wide address bus width, the DSP can efficiently handle large amounts of data for processing, improving its overall performance.

Bit Size: 16

The 16-bit architecture allows for precise calculations and handling of digital signals with high accuracy.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial use where it may be exposed to harsh environmental conditions.

RAM Words: 163840

With a large RAM capacity, the DSP can store and access a significant amount of data quickly, enhancing its processing capabilities.

Maximum Clock Frequency: 19.2 MHz

The high maximum clock frequency allows the DSP to perform operations at a fast pace, making it suitable for real-time signal processing applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Being a mixed digital signal processor, the product can handle a variety of signal processing tasks efficiently, making it versatile in different applications.

Moisture Sensitivity Level (MSL): 4

With MSL level 4, the product is resistant to moisture and can withstand humid conditions, making it reliable in various operating environments.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5912ZZG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 2.75V OR 3.3V SUPPLY

Address Bus Width:

26

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

19.2 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

6

No. of Terminals:

289

No. of Timers:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP5912ZZG Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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