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MSP430F6775AIPEUR

Texas Instruments

MSP430F6775AIPEUR by Texas Instruments

MSP430F6775AIPEUR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.870

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,105 parts In-Stock

1+ parts

$6.260

100+ parts

$5.103

1k+ parts

$3.402

10k+ parts

-

5,105

$6.260

$5.103

$3.402

-

Mouser Electronics

USA . 8 parts In-Stock

1+ parts

$9.480

100+ parts

$7.420

1k+ parts

$5.310

10k+ parts

-

8

$9.480

$7.420

$5.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,388 parts In-Stock

1+ parts

$5.947

100+ parts

-

1k+ parts

-

10k+ parts

-

1,388

$5.947

-

-

-

Vyrian

USA . 3,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,045

-

-

-

-

TME

Poland . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.586

10k+ parts

-

1,500

-

-

$3.586

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,419 parts In-Stock

1+ parts

$5.634

100+ parts

-

1k+ parts

-

10k+ parts

-

1,419

$5.634

-

-

-

Parana Technologies

USA . 372 parts In-Stock

1+ parts

$14.430

100+ parts

-

1k+ parts

$14.869

10k+ parts

-

372

$14.430

-

$14.869

-

DigiPath Technology Company

USA . 1,124 parts In-Stock

1+ parts

$15.889

100+ parts

-

1k+ parts

-

10k+ parts

-

1,124

$15.889

-

-

-

ChromeModa Solutions

Germany . 6,543 parts In-Stock

1+ parts

$16.213

100+ parts

$13.295

1k+ parts

-

10k+ parts

-

6,543

$16.213

$13.295

-

-

IDEA Electronic Components Group

UK . 2,247 parts In-Stock

1+ parts

$16.213

100+ parts

$15.402

1k+ parts

$14.592

10k+ parts

-

2,247

$16.213

$15.402

$14.592

-

Corohmni

South Africa . 312 parts In-Stock

1+ parts

$50.870

100+ parts

-

1k+ parts

-

10k+ parts

-

312

$50.870

-

-

-

Overview

Unlock the limitless possibilities with the MSP430F6775AIPEUR by Texas Instruments. This cutting-edge microprocessor circuit offers unmatched quality and reliability, backed by the renowned manufacturer, Texas Instruments. Ideal for various applications in the industrial sector, this product delivers exceptional value with its high-performance features such as multiple ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, and UART. Experience seamless operation and maximum efficiency with the MSP430F6775AIPEUR, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for different applications.

Bit Size: 16

Offers a good balance between performance and complexity for various tasks.

ADC Channels: YES

Allows for analog input which is essential for many sensor-based applications.

ROM Words: 131072

Ample memory for storing program instructions and data.

Maximum Clock Frequency: 0.032768 MHz

Provides high-speed processing capability for time-critical applications.

Temperature Grade: INDUSTRIAL

Suitable for operation in harsh industrial environments.

Analog To Digital Convertors: 6-Ch 10-Bit

Enables accurate conversion of analog signals to digital data for processing.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple communication interfaces for seamless integration with other devices.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM content for firmware updates.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6775AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6775AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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