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MSP430F67751IPZ

Texas Instruments

MSP430F67751IPZ by Texas Instruments

MSP430F67751IPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART buses and has a max supply voltage of 3.6 V. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.672

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,140 parts In-Stock

1+ parts

$7.684

100+ parts

$6.264

1k+ parts

$4.176

10k+ parts

-

5,140

$7.684

$6.264

$4.176

-

Mouser Electronics

USA . 52 parts In-Stock

1+ parts

$11.660

100+ parts

$6.120

1k+ parts

$5.860

10k+ parts

-

52

$11.660

$6.120

$5.860

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,794 parts In-Stock

1+ parts

$7.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,794

$7.300

-

-

-

Vyrian

USA . 2,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,118

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,451 parts In-Stock

1+ parts

$6.530

100+ parts

$6.367

1k+ parts

$6.334

10k+ parts

-

2,451

$6.530

$6.367

$6.334

-

Corohmni

South Africa . 845 parts In-Stock

1+ parts

$6.680

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$6.680

-

-

-

Corphita

USA . 4,232 parts In-Stock

1+ parts

$6.916

100+ parts

-

1k+ parts

-

10k+ parts

-

4,232

$6.916

-

-

-

Parana Technologies

USA . 621 parts In-Stock

1+ parts

$21.796

100+ parts

-

1k+ parts

$22.265

10k+ parts

-

621

$21.796

-

$22.265

-

DigiPath Technology Company

USA . 1,410 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,410

$24.000

-

-

-

ChromeModa Solutions

Germany . 1,176 parts In-Stock

1+ parts

$24.490

100+ parts

$20.082

1k+ parts

-

10k+ parts

-

1,176

$24.490

$20.082

-

-

IDEA Electronic Components Group

UK . 765 parts In-Stock

1+ parts

$24.490

100+ parts

$23.266

1k+ parts

$22.041

10k+ parts

-

765

$24.490

$23.266

$22.041

-

Microchip USA

USA . 2,713 parts In-Stock

1+ parts

$28.110

100+ parts

$27.710

1k+ parts

$27.510

10k+ parts

$27.310

2,713

$28.110

$27.710

$27.510

$27.310

Perfect Parts

USA . 2,008 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,008

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F67751IPZ. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, setting new standards in the industry. Ideal for a wide range of applications, this device boasts a compact design and advanced technology, making it a top choice for developers and engineers alike. Experience the seamless integration and exceptional quality that only Texas Instruments can provide, revolutionizing the way you approach your projects. Elevate your work to new heights with the MSP430F67751IPZ and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the components inside, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can handle a wide range of power inputs, increasing versatility.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, optimizing layout and design.

Bit Size: 16

16-bit architecture provides a balance between precision and efficiency in data processing.

Power Supplies (V): 2/3.3

Support for 2V and 3.3V power supplies allows flexibility in power options, compatible with various systems.

No. of Terminals: 100

With 100 terminals, this product offers ample connectivity options for interfacing with external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enables compact design and efficient heat dissipation, suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Ability to operate at a minimum supply voltage of 1.8V allows for energy-efficient performance in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures stable operation even in demanding industrial environments.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for various applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, enhancing the product's longevity.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, facilitating sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position offers secure and stable connections, reducing the risk of signal loss or interference.

ROM Words: 131072

ROM capacity of 131072 words provides ample storage for program instructions and data, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm minimizes the overall profile of the product, suitable for slim devices and tight spaces.

RAM Words: 16

16 words of RAM allow for temporary data storage and quick access, enhancing processing efficiency.

Width: 14 mm

Compact width of 14mm enables easy integration into tight PCB layouts, saving space and simplifying design.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures secure solder joints and stable connections during manufacturing processes.

Length: 14 mm

Compact length of 14mm contributes to the overall small footprint of the product, suitable for miniaturized applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporation of a microprocessor circuit as a peripheral IC offers enhanced processing capabilities and feature-rich functionality.

RAM Bytes: 16384

16KB of RAM storage provides sufficient memory space for data manipulation and multitasking, supporting diverse application requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections, enhancing the product's reliability and durability.

Maximum Supply Current: 11.75 mA

Low maximum supply current of 11.75mA contributes to energy efficiency and helps in reducing overall power consumption.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable operation and compatibility with standard power sources for seamless integration.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and configurations, adapting to evolving application needs.

Bus Compatibility: I2C; SPI; UART

Compatibility with I2C, SPI, and UART buses allows for easy interfacing with various peripherals and external devices, enhancing connectivity.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5mm enables precise and compact connections on the PCB, optimizing board layout and design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage and assembly processes.

Speed: 25 rpm

Operates at a speed of 25 rpm, suitable for real-time processing and rapid data transfer in time-sensitive applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67751IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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