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MSP430F6769AIPZR

Texas Instruments

MSP430F6769AIPZR by Texas Instruments

MSP430F6769AIPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and timers. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.551

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$8.551

100+ parts

$7.469

1k+ parts

$5.151

10k+ parts

-

950

$8.551

$7.469

$5.151

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,237 parts In-Stock

1+ parts

$8.123

100+ parts

-

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4,237

$8.123

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Vyrian

USA . 5,422 parts In-Stock

1+ parts

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5,422

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 681 parts In-Stock

1+ parts

$7.270

100+ parts

-

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681

$7.270

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Corphita

USA . 1,664 parts In-Stock

1+ parts

$7.696

100+ parts

-

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1,664

$7.696

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Corohmni

South Africa . 3,070 parts In-Stock

1+ parts

$7.878

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3,070

$7.878

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AZTECH Wire

Italy . 916 parts In-Stock

1+ parts

$10.930

100+ parts

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916

$10.930

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Parana Technologies

USA . 1,320 parts In-Stock

1+ parts

$24.932

100+ parts

-

1k+ parts

$25.626

10k+ parts

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1,320

$24.932

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$25.626

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DigiPath Technology Company

USA . 649 parts In-Stock

1+ parts

$27.453

100+ parts

$25.257

1k+ parts

-

10k+ parts

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649

$27.453

$25.257

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ChromeModa Solutions

Germany . 4,124 parts In-Stock

1+ parts

$28.013

100+ parts

$22.971

1k+ parts

-

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4,124

$28.013

$22.971

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IDEA Electronic Components Group

UK . 538 parts In-Stock

1+ parts

$28.013

100+ parts

$26.612

1k+ parts

$25.212

10k+ parts

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538

$28.013

$26.612

$25.212

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Overview

Experience the seamless integration and top-notch performance of the MSP430F6769AIPZR by Texas Instruments, a leader in cutting-edge technology. This versatile microprocessor circuit offers a wide range of applications, from industrial automation to consumer electronics. With its advanced features like multiple ADC channels, DMA capabilities, and low power consumption, this device provides unmatched value and efficiency for your projects. Trust in Texas Instruments' reputation for quality and innovation, and elevate your designs with the MSP430F6769AIPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, increasing flexibility in usage.

Bit Size: 16

Offers a high level of processing power and capability, making the product suitable for complex tasks.

ADC Channels: YES

Enables analog to digital conversion, allowing the product to interface with a variety of sensors and external devices.

DMA Channels: YES

Supports direct memory access, improving data transfer speed and efficiency for the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Utilizes advanced microprocessor technology, enhancing the product's overall performance and functionality.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Provides a range of communication options, allowing the product to easily connect with other devices and systems.

Speed: 25 rpm

Offers a fast processing speed, ideal for applications that require quick data processing and response times.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6769AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6769AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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