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MSP430F67671AIPZR

Texas Instruments

MSP430F67671AIPZR by Texas Instruments

MSP430F67671AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and timers. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.716

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,700 parts In-Stock

1+ parts

$6.716

100+ parts

$5.475

1k+ parts

$3.650

10k+ parts

-

7,700

$6.716

$5.475

$3.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,224 parts In-Stock

1+ parts

$6.380

100+ parts

-

1k+ parts

-

10k+ parts

-

3,224

$6.380

-

-

-

Vyrian

USA . 3,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,406

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 818 parts In-Stock

1+ parts

$6.044

100+ parts

-

1k+ parts

-

10k+ parts

-

818

$6.044

-

-

-

AZTECH Wire

Italy . 170 parts In-Stock

1+ parts

$17.860

100+ parts

-

1k+ parts

-

10k+ parts

-

170

$17.860

-

-

-

Microchip USA

USA . 2,638 parts In-Stock

1+ parts

$32.350

100+ parts

$32.150

1k+ parts

$32.050

10k+ parts

$31.950

2,638

$32.350

$32.150

$32.050

$31.950

Parana Technologies

USA . 1,497 parts In-Stock

1+ parts

$73.346

100+ parts

-

1k+ parts

-

10k+ parts

-

1,497

$73.346

-

-

-

DigiPath Technology Company

USA . 1,283 parts In-Stock

1+ parts

$80.763

100+ parts

$74.302

1k+ parts

-

10k+ parts

-

1,283

$80.763

$74.302

-

-

Corohmni

South Africa . 1,226 parts In-Stock

1+ parts

$81.972

100+ parts

-

1k+ parts

-

10k+ parts

-

1,226

$81.972

-

-

-

ChromeModa Solutions

Germany . 1,792 parts In-Stock

1+ parts

$82.411

100+ parts

$67.577

1k+ parts

-

10k+ parts

-

1,792

$82.411

$67.577

-

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IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$82.411

100+ parts

$78.290

1k+ parts

$74.170

10k+ parts

-

1,067

$82.411

$78.290

$74.170

-

Overview

Unlock limitless possibilities with the MSP430F67671AIPZR by Texas Instruments! This cutting-edge microcontroller offers unparalleled quality, reliability, and performance. Ideal for a wide range of applications, this product boasts advanced features like multiple ADC channels, DMA channels, and PWM channels. With its innovative technology and robust design, the MSP430F67671AIPZR provides exceptional value and benefits to customers looking for seamless connectivity, high-speed processing, and superior functionality. Elevate your projects to new heights with Texas Instruments' top-of-the-line microprocessor circuit - the choice of industry professionals worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability while keeping the product lightweight.

Surface Mount: YES

Enables easy installation on PCBs.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options.

Package Shape: SQUARE

Saves space on the PCB and simplifies layout design.

Bit Size: 16

Provides sufficient processing power for various applications.

No. of Terminals: 100

Offers multiple connection points for versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances the product's compatibility with modern PCB designs.

Minimum Supply Voltage: 2.4 V

Ensures operation even in low power scenarios.

Maximum Operating Temperature: 85 °C

Suitable for operation in industrial environments.

CPU Family: MSP430

Known for its low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Can withstand harsh cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides reliable electrical connections.

ADC Channels: YES

Allows for analog signals to be converted to digital data.

DMA Channels: YES

Enables efficient data transfer without CPU intervention.

RAM Words: 32

Sufficient memory for data storage and processing.

Peripherals: BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Offers a wide range of features for diverse functionality.

Technology: CMOS

Efficient power usage and high noise immunity.

Analog To Digital Convertors: 6-Ch 10-Bit

Allows for precise conversion of analog signals.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Facilitates communication with external devices through various protocols.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67671AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67671AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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