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MSP430F6747AIPZR

Texas Instruments

MSP430F6747AIPZR by Texas Instruments

MSP430F6747AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and timers. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.344

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 948 parts In-Stock

1+ parts

$6.344

100+ parts

$5.172

1k+ parts

$3.448

10k+ parts

-

948

$6.344

$5.172

$3.448

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,701 parts In-Stock

1+ parts

$6.027

100+ parts

-

1k+ parts

-

10k+ parts

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3,701

$6.027

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Vyrian

USA . 5,062 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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5,062

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,840 parts In-Stock

1+ parts

$5.710

100+ parts

-

1k+ parts

-

10k+ parts

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3,840

$5.710

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-

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Corohmni

South Africa . 47 parts In-Stock

1+ parts

$6.571

100+ parts

-

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47

$6.571

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AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$9.530

100+ parts

-

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621

$9.530

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-

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Microchip USA

USA . 1,303 parts In-Stock

1+ parts

$30.560

100+ parts

$30.370

1k+ parts

$30.280

10k+ parts

$30.180

1,303

$30.560

$30.370

$30.280

$30.180

Parana Technologies

USA . 1,209 parts In-Stock

1+ parts

$30.666

100+ parts

-

1k+ parts

$69.226

10k+ parts

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1,209

$30.666

-

$69.226

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DigiPath Technology Company

USA . 1,003 parts In-Stock

1+ parts

$33.767

100+ parts

$31.066

1k+ parts

-

10k+ parts

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1,003

$33.767

$31.066

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ChromeModa Solutions

Germany . 2,308 parts In-Stock

1+ parts

$34.456

100+ parts

$28.254

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2,308

$34.456

$28.254

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IDEA Electronic Components Group

UK . 2,144 parts In-Stock

1+ parts

$34.456

100+ parts

$32.733

1k+ parts

$31.010

10k+ parts

-

2,144

$34.456

$32.733

$31.010

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Component Stockers USA

USA . 692 parts In-Stock

1+ parts

$88.260

100+ parts

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1k+ parts

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10k+ parts

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692

$88.260

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Overview

Unlock endless possibilities with the MSP430F6747AIPZR by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, making it the top choice for a wide range of applications. With a maximum clock frequency of 0.032768 MHz and extensive connectivity options, this industrial-grade device delivers unmatched performance and flexibility. Experience seamless operation and enhanced functionality with the MSP430F6747AIPZR, designed to exceed your expectations and elevate your projects to new heights. Trust Texas Instruments for superior technology that empowers innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the integrated circuits inside, making this product robust and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

Supporting a higher supply voltage allows for flexibility in power source selection and compatibility with various applications.

Package Shape: SQUARE

Square packages are space-efficient and minimize wasted board space, enhancing overall design efficiency.

Bit Size: 16

A larger bit size enables the processor to handle more complex operations and data manipulation, improving overall performance.

No. of Terminals: 100

Having a sufficient number of terminals allows for connectivity to a variety of external components and peripherals, expanding functionality.

Minimum Supply Voltage: 2.4 V

Supporting a low minimum supply voltage ensures energy-efficient operation and compatibility with battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended use without overheating.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this product suitable for energy-efficient applications.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this product can function reliably in extreme cold environments.

ADC Channels: YES

Having analog-to-digital converter channels allows for analog sensor interfacing and data conversion, enhancing application flexibility.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, reducing the burden on the CPU and enhancing overall system performance.

ROM Words: 262144

With a large ROM capacity, this product can store a significant amount of program data, facilitating complex application logic.

RAM Words: 32

While modest in size, the RAM capacity is sufficient for temporary data storage and efficient program execution.

Peripherals: BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

A variety of integrated peripherals enable versatile functionality and support for a wide range of applications.

Maximum Clock Frequency: 0.032768 MHz

The maximum clock frequency allows for fast processing speeds and real-time operation, enhancing system responsiveness.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog components, such as motors and LEDs, enhancing system capabilities.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Support for various communication protocols enables easy integration with external devices and systems, expanding connectivity options.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization, enhancing product flexibility and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6747AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6747AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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