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MSP430F6745AIPEUR

Texas Instruments

MSP430F6745AIPEUR by Texas Instruments

MSP430F6745AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.260

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,511 parts In-Stock

1+ parts

$6.260

100+ parts

$5.103

1k+ parts

$3.402

10k+ parts

-

3,511

$6.260

$5.103

$3.402

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,103 parts In-Stock

1+ parts

$5.947

100+ parts

-

1k+ parts

-

10k+ parts

-

2,103

$5.947

-

-

-

Vyrian

USA . 3,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,612

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,430 parts In-Stock

1+ parts

$5.634

100+ parts

-

1k+ parts

-

10k+ parts

-

2,430

$5.634

-

-

-

Corohmni

South Africa . 267 parts In-Stock

1+ parts

$5.723

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$5.723

-

-

-

AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$16.930

100+ parts

-

1k+ parts

-

10k+ parts

-

472

$16.930

-

-

-

Parana Technologies

USA . 2,286 parts In-Stock

1+ parts

$67.034

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$67.034

-

-

-

DigiPath Technology Company

USA . 1,361 parts In-Stock

1+ parts

$73.813

100+ parts

$67.908

1k+ parts

-

10k+ parts

-

1,361

$73.813

$67.908

-

-

ChromeModa Solutions

Germany . 6,675 parts In-Stock

1+ parts

$75.319

100+ parts

$61.762

1k+ parts

-

10k+ parts

-

6,675

$75.319

$61.762

-

-

IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$75.319

100+ parts

$71.553

1k+ parts

$67.787

10k+ parts

-

179

$75.319

$71.553

$67.787

-

Overview

Unlock the full potential of your electronic projects with the MSP430F6745AIPEUR by Texas Instruments. Known for their top-quality products, Texas Instruments delivers advanced solutions for a wide range of applications in the microprocessor circuit category. This versatile IC offers unmatched value with its high-performance features like ADC channels, PWM channels, and multiple connectivity options. Whether you're working on industrial automation or IoT devices, this compact and reliable microprocessor will help you bring your ideas to life with ease. Choose Texas Instruments for cutting-edge technology and seamless integration in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and secure mounting on a circuit board, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Offers a wide operating range for flexibility in different power supply setups.

Package Shape: RECTANGULAR

Compact shape that fits well within circuit layouts and allows for efficient use of space.

Bit Size: 16

Provides high computational capabilities and precision in processing data.

No. of Terminals: 128

Sufficient terminals for interfacing with other components and peripherals in a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances thermal dissipation and offers compatibility with modern PCB designs.

Minimum Supply Voltage: 2.4 V

Allows for operation in lower voltage scenarios while maintaining performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where extended temperature ranges may be encountered.

CPU Family: MSP430

Part of a well-established and reliable microcontroller family with a range of features and support.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

Supports efficient data transfer between memory and peripherals, optimizing performance.

Terminal Position: QUAD

Facilitates easy connection to external components and allows for organized wiring layouts.

ROM Words: 131072

Ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact system integration and reduced overall size.

RAM Words: 16

Provides storage for temporary data processing, enhancing computational efficiency.

Width: 14 mm

Compact form factor suitable for space-constrained applications.

Peripherals: BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

A diverse set of integrated peripherals for versatile functionality and system control.

Maximum Clock Frequency: 0.032768 MHz

Supports precise timing and high-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering performance during assembly processes.

Peak Reflow Temperature °C: 260

Compatibility with standard reflow soldering processes for ease of manufacturing.

Length: 20 mm

Optimal size for various PCB layouts and system configurations.

Temperature Grade: INDUSTRIAL

Suitable for demanding industrial environments with extended temperature ranges and harsh conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Designed for microcontroller applications with integrated peripheral functionality.

RAM Bytes: 16384

Generous memory capacity for data storage and manipulation.

Technology: CMOS

Efficient power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connections on the PCB.

Analog To Digital Convertors: 6-Ch 10-Bit

Multiple ADC channels for interfacing with analog sensors and signals with high resolution.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog circuits and devices.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Versatile communication interfaces for seamless connection to external devices and systems.

ROM Programmability: FLASH

Allows for easy and flexible updating of firmware and program code.

Bus Compatibility: I2C; SPI; UART

Supports a range of common communication protocols for enhanced system integration.

Terminal Pitch: 0.5 mm

Fine pitch spacing for precise connections and compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure during storage and operation.

Speed: 25 rpm

Operates at a moderate speed suitable for a wide range of applications and processing tasks.

On Chip Program ROM Width: 8

Efficient use of on-chip memory for storing program instructions.

No. of I/O Lines: 90

Sufficient I/O lines for interfacing with external peripherals and components in a system.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6745AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6745AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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