Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments AM3894BCYG150 is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It features a max clock frequency of 27 MHz, making it suitable for high-speed applications in various industries such as telecommunications and industrial automation. The package style is grid array with fine pitch, offering a compact design for space-constrained environments.
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This material provides durability and protection for the microprocessor, making it suitable for a variety of environments.
Having integrated cache helps improve the performance of the microprocessor by reducing access time to frequently used data.
Surface mount technology allows for easy and efficient installation of the microprocessor on a printed circuit board.
Operating within this voltage range ensures stable and efficient performance of the microprocessor.
A wider address bus allows the microprocessor to access a larger memory address space, enabling it to handle more complex tasks.
The square shape of the package provides easy integration and efficient use of space on the PCB.
With a 32-bit architecture, the microprocessor can handle larger data chunks at once, improving overall processing speed.
Having a high number of terminals allows for a greater integration of functions and features, enhancing the capabilities of the microprocessor.
The grid array and fine pitch design of the package style enable high-density packaging, making the microprocessor suitable for compact electronic devices.
Even at lower supply voltages, the microprocessor can operate efficiently, consuming less power and reducing heat generation.
This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.
The bottom terminal position simplifies the installation and connection of the microprocessor on the PCB.
The low seated height of the microprocessor allows for slim and compact device designs while maintaining high performance.
The compact width of the microprocessor facilitates space-saving integration in various electronic applications.
Boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing process, ensuring high reliability.
A wider external data bus enables faster data transfer between the microprocessor and other components, enhancing overall system performance.
Operating at a high clock frequency allows the microprocessor to process instructions quickly and efficiently, improving overall system performance.
With a short reflow time, the microprocessor can be quickly and effectively soldered onto the PCB during manufacturing.
The high peak reflow temperature tolerance ensures reliable solder joints and robust connections for the microprocessor.
The compact length of the microprocessor contributes to efficient space utilization in electronic device designs.
Being a RISC-based microprocessor enables efficient and simplified instruction execution, enhancing overall system performance.
CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and reliable.
The ball terminal form provides secure and reliable connections for the microprocessor, ensuring consistent performance.
Operating at a nominal supply voltage of 1V ensures stable and efficient performance of the microprocessor in various applications.
The small terminal pitch allows for high-density integration of the microprocessor on the PCB, enabling compact device designs.
Support for floating-point operations enhances the microprocessor's capability to handle complex mathematical calculations and algorithms efficiently.
Having a moisture sensitivity level of 4 indicates that the microprocessor can withstand exposure to moderate levels of moisture during handling and assembly.
Operating at a speed of 1500 rpm allows the microprocessor to deliver fast and responsive performance in various computing applications.
The low power mode feature allows the microprocessor to operate with reduced power consumption, extending battery life and reducing heat generation.
Microprocessors AM3894BCYG150 attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
AM3894BCYG150 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Freon/Netra/SubArtic EOL 06/Oct/2015 Freon/Netra/SubArtic EOL Update 4/Nov/2015
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
BAV99
Philips Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
FDLL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
Fairchild Semiconductor
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
AM3703CUSD100
Texas Instruments
AM3703CUSD100 by Texas Instruments is a 32-bit microprocessor with 423 terminals, operating at up to 54 MHz. It features an integrated cache, 8-bit data RAM width, and 26-bit address bus width. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
AM5728BABCXA
AM5728BABCXA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at max 38.4 MHz clock frequency. Ideal for industrial applications, it features a low power mode and operates in an extended temperature range from -40 to 105°C.
MCF5307CAI66B
NXP Semiconductors
The NXP Semiconductors MCF5307CAI66B microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 33.33 MHz. It is suitable for applications requiring low power mode operation, such as embedded systems and industrial control. The device comes in a square package shape with 208 terminals, supporting boundary scan testing for enhanced reliability.
MIMXRT595SFFOC
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MPC860TCZQ66D4
NXP Semiconductors' MPC860TCZQ66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for low power applications, it operates at a speed of 66 rpm and supports integrated cache memory. Suitable for various embedded systems requiring high processing capabilities.
MCF5270VM100J
Freescale Semiconductor
MCF5270VM100J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 24-bit address bus width. It operates at a max supply voltage of 1.6V and is suitable for applications requiring low power mode, such as embedded systems and industrial automation. With a package style of grid array and low profile, it offers high performance in a compact form factor.
TA80960KB-16
Intel
Intel's TA80960KB-16 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 32 MHz. Ideal for automotive applications, it operates b/w -40 to 125 °C, with a power supply range of 4.5-5.5 V and a max supply current of 315 mA.
AM5726BABCXA
The Texas Instruments AM5726BABCXA microprocessor features a 32-bit external data bus width, operates at a max clock frequency of 38.4 MHz, and has an industrial temperature grade. It is commonly used in applications requiring high-speed processing and low power consumption, such as industrial automation systems and embedded computing devices.
MCF5307AI90B
The NXP Semiconductors MCF5307AI90B microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 45.45 MHz. It is suitable for applications requiring low power mode operation, such as embedded systems and industrial automation.
MIMXRT533SFFOCR
ATSAMA5D31A-CFU
ATSAMA5D31A-CFU by Microchip Technology is a 32-bit microprocessor with integrated cache and a max clock frequency of 48 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
AV8063801116903SR0T5
Intel AV8063801116903SR0T5 is a 64-bit microprocessor with integrated cache, CMOS technology, and speed of 3200 rpm. It features a grid array package style with 1023 terminals for surface mount applications. Ideal for high-performance computing and server applications.
MC7455ARX1000LG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
MC9328MX1CVM15R2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
MIMXRT1166CVM5A
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
P2020NSE2MHC
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
MPC8347ECZQAGDB
The NXP Semiconductors MPC8347ECZQAGDB microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is designed for industrial applications requiring low power mode, integrated cache, and boundary scan capabilities.
MPC880CZP66
NXP Semiconductors' MPC880CZP66 is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. It features a CMOS technology and low power mode, suitable for applications requiring high-speed processing in compact devices. The package style is grid array with 357 terminals, making it ideal for surface mount assembly processes.
MCF54416CMJ250
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
NHPXA270C5C312
Marvell Technology
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
AM3894CCYGA120
AM3894CCYGA120 by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 27 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
AM3894CCYG120
The Texas Instruments AM3894CCYG120 microprocessor features 32-bit architecture, 8-word data RAM width, and a clock frequency of up to 27 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and networking equipment.
AM3894CCYG135
The Texas Instruments AM3894CCYG135 is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 27 MHz, suitable for applications requiring high-speed processing. With a package style of grid array, fine pitch, it is ideal for use in devices where compact size and efficient performance are essential.
AM3874CCYEA80
The Texas Instruments AM3874CCYEA80 microprocessor features 32-bit architecture, 8-word data RAM width, and 16-bit external data bus. Ideal for industrial applications, it operates b/w -40 to 105°C with a clock frequency of up to 30 MHz. With low power mode and integrated cache, it offers high-speed processing capabilities in a compact square package.
AM3872BCYEA100
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;
AM3874CCYEA100
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;
AM3892BCYG120
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1031; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;
AM3892BCYG150
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1031; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
AM3871BCYE80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B684;
AM3871CCYE100
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;
AM3874BCYE100
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;
AM3874CCYE80
AM3872BCYE80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; External Data Bus Width: 16;
AM3874BCYE80
AM3871BCYEA80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
AM3871CCYE80
AM3874BCYEA100
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Speed: 1000 rpm;
AM3874BCYEA80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;
AM3872BCYEA80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Bit Size: 32;
AM3871BCYE100
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Low Power Mode: YES;
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