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AM3354ZCED50

Texas Instruments

AM3354ZCED50 by Texas Instruments

AM3354ZCED50 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit external data bus width, and max clock frequency of 26 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

Median Price

$17.720

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 156 parts In-Stock

1+ parts

$1.720

100+ parts

$1.720

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$1.720

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156

$1.720

$1.720

$1.720

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Rochester

USA . 397 parts In-Stock

1+ parts

-

100+ parts

$16.440

1k+ parts

$14.710

10k+ parts

$13.840

397

-

$16.440

$14.710

$13.840

DigiKey

USA . 397 parts In-Stock

1+ parts

-

100+ parts

$19.000

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397

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$19.000

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Verical

USA . 267 parts In-Stock

1+ parts

-

100+ parts

$20.550

1k+ parts

$18.387

10k+ parts

$17.300

267

-

$20.550

$18.387

$17.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 501 parts In-Stock

1+ parts

$17.356

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501

$17.356

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Vyrian

USA . 3,661 parts In-Stock

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3,661

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Bristol Electronics

USA . 148 parts In-Stock

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Dan-Mar Components

USA . 148 parts In-Stock

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148

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Distributors (Availability)

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Native Components

USA . 636 parts In-Stock

1+ parts

$9.296

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636

$9.296

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Northwest PG Solutions

USA . 1,893 parts In-Stock

1+ parts

$10.226

100+ parts

$9.203

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1,893

$10.226

$9.203

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Corphita

USA . 4,845 parts In-Stock

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$16.443

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4,845

$16.443

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Parana Technologies

USA . 567 parts In-Stock

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$46.422

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567

$46.422

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DigiPath Technology Company

USA . 751 parts In-Stock

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$51.117

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751

$51.117

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ChromeModa Solutions

Germany . 5,634 parts In-Stock

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$52.160

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$42.771

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5,634

$52.160

$42.771

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IDEA Electronic Components Group

UK . 2,193 parts In-Stock

1+ parts

$52.160

100+ parts

$49.552

1k+ parts

$46.944

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2,193

$52.160

$49.552

$46.944

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Perfect Parts

USA . 635 parts In-Stock

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635

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Microchip USA

USA . 157 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments AM3354ZCED50 microprocessor. As a leader in the industry, Texas Instruments provides cutting-edge technology for a wide range of applications. This microprocessor offers integrated cache, a low profile package style, and boundary scan capabilities, making it ideal for high-speed processing tasks. With a nominal supply voltage of 1.1V and low power mode feature, this microprocessor delivers exceptional energy efficiency. Trust Texas Instruments for top-quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microprocessor a reliable choice for various applications.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microprocessor by reducing memory access times and increasing processing speeds.

Surface Mount: YES

Being surface mountable makes installation and replacement of the microprocessor easier, saving time and effort.

Maximum Supply Voltage: 1.144 V

With a maximum supply voltage of 1.144 V, this microprocessor operates efficiently while consuming minimal power.

Address Bus Width: 28

A wider address bus allows for larger memory addressing capabilities, which is important for handling complex computing tasks.

Package Shape: SQUARE

The square package shape provides a compact design, making it suitable for space-constrained applications.

Bit Size: 32

With a 32-bit architecture, this microprocessor can handle larger chunks of data at a time, improving overall performance.

Power Supplies (V): 0.95/1.1

The microprocessor can operate effectively within a range of supply voltages, providing flexibility in different power supply configurations.

No. of Terminals: 298

Having a high number of terminals allows for connectivity with various external components, enhancing the functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style ensures easy mounting and soldering, making it suitable for high-density circuit designs.

Minimum Supply Voltage: 1.056 V

The microprocessor can operate at a low supply voltage, promoting energy efficiency and reducing power consumption.

Terminal Finish: TIN SILVER COPPER

This terminal finish offers good conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and connectivity within the circuit board layout.

Maximum Seated Height: 1.3 mm

The low seated height allows for a slim design, making it suitable for compact electronic devices.

Width: 13 mm

The compact width of the microprocessor enables space-efficient placement on the circuit board.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing process.

External Data Bus Width: 16

The external data bus width of 16 bits allows for efficient data transfer between the microprocessor and external devices.

Maximum Clock Frequency: 26 MHz

The high clock frequency enables fast data processing and execution of instructions, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor can withstand peak reflow temperatures for an extended period, ensuring reliable soldering connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and assembly of the microprocessor on the circuit board.

Length: 13 mm

The compact length of the microprocessor allows for space-efficient placement on the circuit board.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor with peripheral capabilities, this product offers efficient and streamlined processing of instructions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections between the microprocessor and the circuit board.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V provides a stable power source for the microprocessor, ensuring consistent performance.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, making the microprocessor suitable for compact electronic designs.

Format: FIXED POINT

The fixed-point format allows for precise arithmetic operations, enabling accurate calculations and processing of data.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during assembly and storage.

Speed: 500 rpm

The high speed of 500 rpm allows for fast data processing and execution, enhancing the overall performance of the microprocessor.

Low Power Mode: YES

Having a low power mode can help reduce energy consumption during idle or low-demand periods, improving overall efficiency.

Technical Specifications

Microprocessors AM3354ZCED50 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

298

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

500 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3354ZCED50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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