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AM1808EZCE3

Texas Instruments

AM1808EZCE3 by Texas Instruments

AM1808EZCE3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power applications in industrial settings. The package style is grid array, making it ideal for compact designs requiring high processing speeds.

Median Price

$12.732

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,310 parts In-Stock

1+ parts

$13.562

100+ parts

$11.847

1k+ parts

$8.170

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2,310

$13.562

$11.847

$8.170

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Avnet

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

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$11.902

10k+ parts

$11.597

640

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-

$11.902

$11.597

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,792 parts In-Stock

1+ parts

$12.884

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2,792

$12.884

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Vyrian

USA . 7,858 parts In-Stock

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7,858

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Cyclops Electronics Ltd

UK . 160 parts In-Stock

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160

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Distributors (Availability)

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Corphita

USA . 1,188 parts In-Stock

1+ parts

$12.206

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1,188

$12.206

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AZTECH Wire

Italy . 303 parts In-Stock

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$12.210

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303

$12.210

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Parana Technologies

USA . 574 parts In-Stock

1+ parts

$45.253

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574

$45.253

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DigiPath Technology Company

USA . 65 parts In-Stock

1+ parts

$49.829

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65

$49.829

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ChromeModa Solutions

Germany . 4,374 parts In-Stock

1+ parts

$50.846

100+ parts

$41.694

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4,374

$50.846

$41.694

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IDEA Electronic Components Group

UK . 916 parts In-Stock

1+ parts

$50.846

100+ parts

$48.304

1k+ parts

$45.761

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916

$50.846

$48.304

$45.761

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Northwest PG Solutions

USA . 1,613 parts In-Stock

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1,613

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Native Components

USA . 653 parts In-Stock

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653

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Overview

Experience the power and efficiency of the Texas Instruments AM1808EZCE3 Microprocessor. With top-notch quality and cutting-edge technology, this microprocessor offers seamless performance for a wide range of applications. Whether you're looking to improve your industrial automation systems or enhance your consumer electronics devices, this microprocessor delivers unmatched value, benefits, and advantages. Trust in Texas Instruments for superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and helps in protecting the microprocessor from external damage, making it a reliable choice for long-term use.

Integrated Cache: YES

Integrated cache helps in improving the processing speed of the microprocessor by storing frequently accessed data, resulting in faster computing performance.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows the microprocessor to handle more power without overheating, enhancing its overall performance.

Address Bus Width: 23

A wider address bus width allows the microprocessor to access a larger memory space, enabling it to handle complex tasks efficiently.

Package Shape: SQUARE

Square package shape helps in easy installation and placement of the microprocessor on the circuit board, ensuring proper alignment and connectivity.

Bit Size: 32

32-bit architecture allows the microprocessor to process data in larger chunks, improving overall speed and performance of the system.

No. of Terminals: 361

Higher number of terminals provides more connectivity options for peripherals, making the microprocessor versatile and compatible with various devices.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures that the microprocessor can function in a wide range of environments, making it suitable for different applications.

Maximum Seated Height: 1.3 mm

Low maximum seated height allows for a compact design, making the microprocessor suitable for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC (Reduced Instruction Set Computing) architecture enhances the efficiency of the microprocessor by simplifying instructions, resulting in faster execution of tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Technical Specifications

Microprocessors AM1808EZCE3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Speed:

375 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1808EZCE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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