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STLVDS9637BDR

STMicroelectronics

STLVDS9637BDR by STMicroelectronics

STLVDS9637BDR from STMicroelectronics is a dual line receiver with a max supply voltage of 3.6V and operates in industrial temperatures (-40 °C to 85 °C). It features low output current (8A) and fast receive delay (3.3ns), ideal for high-speed data communication applications. Its compact SOIC package ensures efficient surface mounting in various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,306 parts In-Stock

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8,306

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Digiode

USA . 2,624 parts In-Stock

1+ parts

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-

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2,624

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Anansix

USA . 311 parts In-Stock

1+ parts

-

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311

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 30 parts In-Stock

1+ parts

$6.867

100+ parts

-

1k+ parts

$6.180

10k+ parts

-

30

$6.867

-

$6.180

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Microchip USA

USA . 445 parts In-Stock

1+ parts

$8.187

100+ parts

-

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-

10k+ parts

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445

$8.187

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AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$8.280

100+ parts

-

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568

$8.280

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MKK Technologies

India . 1,974 parts In-Stock

1+ parts

$12.913

100+ parts

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1,974

$12.913

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DigiPath Technology Company

USA . 1,974 parts In-Stock

1+ parts

$12.913

100+ parts

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10k+ parts

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1,974

$12.913

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Corphita

USA . 3,965 parts In-Stock

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3,965

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Vigor

Singapore . 2,115 parts In-Stock

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2,115

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Parana Technologies

USA . 2,060 parts In-Stock

1+ parts

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100+ parts

$8.210

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2,060

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$8.210

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Overview

Elevate your designs with the STLVDS9637BDR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance line driver and receiver ensures reliable data transmission with minimal power consumption, perfect for industrial applications demanding robustness. Enjoy seamless integration in your systems while benefiting from ST's commitment to quality and excellence, ensuring your projects are both efficient and future-proof.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials enhance the product's resilience and longevity.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into various PCB layouts.

Maximum Supply Voltage: 3.6 V

This limits power consumption, making the product energy-efficient while ensuring reliability.

No. of Functions: 2

Dual functionality increases versatility, allowing for more complex applications without additional components.

Package Shape: RECTANGULAR

Standard shape aids in easier mounting and placement during manufacturing.

Power Supplies (V): 3.3

Optimized for compatibility with common supply voltages, ensuring broad usability across devices.

No. of Terminals: 8

Provides sufficient connectivity options while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

Space-efficient design is ideal for densely packed electronics, helping to save PCB real estate.

Minimum Supply Voltage: 3 V

Flexible voltage requirements enhance compatibility with a variety of systems.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes this product suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme conditions, making it ideal for harsh applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finish ensures better conductivity and corrosion resistance, enhancing reliability.

Terminal Position: DUAL

Dual positioning allows for flexible layout options during PCB design, increasing design efficiency.

Maximum Seated Height: 1.75 mm

Low profile design fits well in compact applications, reducing overall device height.

Width: 3.9 mm

Narrow width aids in space-saving designs, ideal for compact electronic devices.

Maximum Output Low Current: 8 Amp

High output capability supports demanding applications, making it suitable for power-intensive tasks.

Receiver No. of Bits: 2

Dual-bit reception increases data processing capabilities, allowing for efficient communication.

Length: 4.9 mm

Compact length allows for efficient use of space on circuit boards.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring robustness in challenging environments.

Maximum Receive Delay: 3.3 ns

Fast response time facilitates high-speed data transfer, making it suitable for time-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering and easy visual inspection, enhancing manufacturability.

Interface Standard: EIA-644; TIA-644; EIA-422-B; TIA-422-B

Compatibility with established standards ensures interoperability with a wide range of devices.

Maximum Supply Current: 10 mA

Low current consumption contributes to overall system efficiency and extends battery life in portable applications.

Input Characteristics: DIFFERENTIAL

Differential inputs improve noise immunity and signal integrity, enhancing overall performance.

Nominal Supply Voltage: 3.3 V

Common nominal supply voltage ensures compatibility with most modern electronic devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for ease of soldering and compatibility with a variety of PCB layouts.

Interface IC Type: LINE RECEIVER

Designed specifically as a line receiver, optimizing performance for data communication applications.

Technical Specifications

Line Drivers & Receivers STLVDS9637BDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644; EIA-422-B; TIA-422-B

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3.3 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

STLVDS9637BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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