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STGP10NC60K

STMicroelectronics

STGP10NC60K by STMicroelectronics

STGP10NC60K from STMicroelectronics is an N-channel IGBT designed for power control applications. It features a max collector-emitter voltage of 600 V, a power dissipation of 60 W, and operates at up to 150 °C. Its fast switching times (ton: 23 ns, toff: 242 ns) enhance efficiency in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,321 parts In-Stock

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4,321

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Vyrian

USA . 2,090 parts In-Stock

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2,090

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Anansix

USA . 606 parts In-Stock

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606

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,654 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

$1.182

10k+ parts

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1,654

$1.314

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$1.182

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MKK Technologies

India . 1,239 parts In-Stock

1+ parts

$2.470

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1,239

$2.470

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DigiPath Technology Company

USA . 1,239 parts In-Stock

1+ parts

$2.470

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1,239

$2.470

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AZTECH Wire

Italy . 1,059 parts In-Stock

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$13.470

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1,059

$13.470

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Kepictronics

USA . 33,000 parts In-Stock

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33,000

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Corphita

USA . 4,244 parts In-Stock

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4,244

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Parana Technologies

USA . 1,176 parts In-Stock

1+ parts

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$1.571

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1,176

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$1.571

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Overview

Unlock unparalleled performance with the STGP10NC60K from STMicroelectronics, a leader in advanced semiconductor solutions. This high-quality IGBT offers exceptional power control for various applications, ensuring efficiency and reliability in demanding environments. With its robust construction and proven technology, customers benefit from lower energy consumption, reduced heat generation, and enhanced system longevity—perfect for industrial automation and renewable energy systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package ensures durability and lightweight design, making it suitable for various applications where weight and robustness are crucial.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and are commonly used in power applications, providing better performance in high-speed switching.

Configuration: SINGLE

A single configuration simplifies design in circuits, making it easy to integrate into existing systems with minimal complexity.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for switching and efficiency, suitable for industrial applications such as motor drives and power supplies.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient usage of space on PCBs and facilitates easier handling during assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are ideal for high-power applications, ensuring reliable connections in demanding environments.

Nominal Turn Off Time (toff): 242 ns

A fast turn-off time allows for high-frequency operation, which enhances performance in applications that require rapid switching.

No. of Terminals: 3

Having three terminals enables versatile circuit configurations, including multiple switching arrangements, enhancing design flexibility.

Maximum Power Dissipation (Abs): 60 W

A maximum power dissipation of 60 W allows this IGBT to handle substantial power loads without overheating, increasing reliability and longevity.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides excellent heat dissipation and stability, making it ideal for high-power applications in variable environmental conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can perform efficiently in extreme conditions, ensuring reliable performance even in harsher environments.

Maximum Collector-Emitter Voltage: 600 V

A high maximum collector-emitter voltage of 600 V makes this transistor suitable for high-voltage applications, providing versatility across various power control scenarios.

Transistor Element Material: SILICON

Silicon as the element material ensures good thermal conductivity and electrical performance, essential for power applications where both are crucial.

Maximum Gate-Emitter Voltage: 20 V

The capability to handle a maximum gate-emitter voltage of 20 V allows for greater flexibility in controlling the device, facilitating circuit design optimization.

Maximum Collector Current (IC): 20 A

A maximum collector current of 20 A enables the IGBT to effectively manage significant current loads, making it suitable for various high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

A lower gate-emitter threshold voltage of 6.5 V improves efficiency in switching operations, allowing for more precise and reliable control in circuits.

Terminal Position: SINGLE

A single terminal position simplifies layout design on circuit boards and enhances ease of connection during assembly.

Nominal Turn On Time (ton): 23 ns

A very short turn-on time of 23 ns allows for rapid switching capabilities, making this IGBT suitable for high-frequency applications and improving overall system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP10NC60K attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

ULTRA FAST

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

242 ns

Nominal Turn On Time (ton):

23 ns

Trade Compliance

STGP10NC60K Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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