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PSD813F1VA-20UI

STMicroelectronics

PSD813F1VA-20UI by STMicroelectronics

PSD813F1VA-20UI by STMicroelectronics is a 128Kx8 NOR Flash memory with a synchronous operating mode, ideal for industrial applications. It operates at 3.0-3.6V and withstands temperatures from -40 °C to 85 °C. With a max access time of 20ns, it ensures efficient data retrieval.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,300 parts In-Stock

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5,300

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Digiode

USA . 2,873 parts In-Stock

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2,873

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Anansix

USA . 977 parts In-Stock

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977

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Inland Empire Components Inc.

USA . 793 parts In-Stock

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793

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Inventory MP

USA . 19 parts In-Stock

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Bristol Electronics

USA . 19 parts In-Stock

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IDEA Electronic Components Group

UK . 1,031 parts In-Stock

1+ parts

$5.399

100+ parts

-

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$4.859

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1,031

$5.399

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$4.859

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Microchip USA

USA . 279 parts In-Stock

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$6.298

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279

$6.298

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MKK Technologies

India . 1,647 parts In-Stock

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$10.152

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$10.152

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DigiPath Technology Company

USA . 1,647 parts In-Stock

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$10.152

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1,647

$10.152

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AZTECH Wire

Italy . 919 parts In-Stock

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$11.710

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919

$11.710

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Corphita

USA . 4,574 parts In-Stock

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Parana Technologies

USA . 2,347 parts In-Stock

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$6.455

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$6.455

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Kepictronics

USA . 1,080 parts In-Stock

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1,080

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Overview

Unlock exceptional performance and reliability with the PSD813F1VA-20UI from STMicroelectronics. Renowned for their innovation and quality, STMicroelectronics delivers a high-performance FLASH memory solution designed for industrial applications. This compact, versatile chip ensures rapid data access and low power consumption, making it perfect for demanding environments. Invest in durability and efficiency to elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy helps protect the internal components, making the flash memory robust and reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact circuit designs, facilitating easier integration into modern electronic devices.

Package Shape: SQUARE

The square shape is space-efficient, optimizing PCB layout and contributing to a smaller overall device size.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance by providing higher data transfer rates, making the product suitable for high-speed applications.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal voltage of 3.3V aligns with common digital circuitry requirements, ensuring compatibility with many devices.

No. of Terminals: 52

A higher number of terminals allows for more connections, facilitating complex designs and increased functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal and electrical performance, ideal for high-speed operations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where higher temperatures are common.

Organization: 128KX8

The organization of 128KX8 provides efficient memory structuring, which is beneficial for various data storage applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable operation in extreme environments, essential for industrial use.

Terminal Position: QUAD

The quad terminal position facilitates better connectivity and signal integrity, reducing the likelihood of signal interference.

Maximum Seated Height: 4.57 mm

A low seated height supports compact designs, allowing for better utilization of space in electronics.

Width: 19 mm

The width of 19 mm contributes to a versatile form factor, enabling various integration options.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V ensures the product can operate effectively even in voltage-supply constrained environments.

Type: NOR TYPE

NOR flash memory allows for faster read speeds and greater flexibility in accessing memory, making it ideal for code storage.

Length: 19.1 mm

The length of 19.1 mm complements the compact design, making it suitable for space-constrained applications.

Programming Voltage (V): 3.3

Using a programming voltage of 3.3V aligns with standard digital components, enhancing compatibility.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this grade ensures durability and reliability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high density, making it energy-efficient while maximizing storage capacity.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer rates, making it suitable for applications that demand high performance.

Terminal Form: J BEND

The J bend terminal form facilitates easier soldering and integration onto circuit boards.

No. of Words: 131072 words

The capacity of 131072 words provides ample storage space for various applications, from firmware to large data sets.

Memory Width: 8

With a memory width of 8 bits, this product offers efficient data handling, enhancing overall system performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for denser packing of components on a PCB, conserving space without sacrificing performance.

No. of Words Code: 128K

The 128K words code ensures ample storage for applications requiring substantial data retention.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V provides a safety margin for reliable operation under fluctuating power conditions.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of 10 ms is efficient for various applications, allowing quick reprogramming of the memory.

Memory Density: 1048576 bit

With a density of 1 Megabit, it can accommodate a significant amount of data, making it versatile for different usage scenarios.

Memory IC Type: FLASH

Being a flash memory IC enables non-volatile storage, retaining data even without power, perfect for essential data retention.

Maximum Access Time: 20 ns

A rapid maximum access time of 20 ns is essential for high-speed applications, ensuring quick data retrieval.

Technical Specifications

Flash Memory PSD813F1VA-20UI attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

20 ns

JESD-30 Code:

S-PQCC-J52

Length:

19.1 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

19 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1VA-20UI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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