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PSD813F1AV-12JT

STMicroelectronics

PSD813F1AV-12JT by STMicroelectronics

PSD813F1AV-12JT from STMicroelectronics is a 128Kx8 NOR Flash memory with a 3.3V supply, ideal for synchronous applications. It features a max access time of 12 ns and operates within -0 °C to 70 °C. This compact chip carrier design ensures efficient data storage in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,789 parts In-Stock

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2,789

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Vyrian

USA . 1,339 parts In-Stock

1+ parts

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1,339

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Digiode

USA . 557 parts In-Stock

1+ parts

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557

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 63 parts In-Stock

1+ parts

$2.848

100+ parts

-

1k+ parts

$2.563

10k+ parts

-

63

$2.848

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$2.563

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MKK Technologies

India . 1,965 parts In-Stock

1+ parts

$5.356

100+ parts

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1,965

$5.356

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DigiPath Technology Company

USA . 1,965 parts In-Stock

1+ parts

$5.356

100+ parts

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1,965

$5.356

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Corphita

USA . 3,317 parts In-Stock

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3,317

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Parana Technologies

USA . 788 parts In-Stock

1+ parts

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$3.406

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788

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$3.406

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Overview

Elevate your designs with the PSD813F1AV-12JT from STMicroelectronics, a leader in innovative technology. This high-performance flash memory offers fast access and reliability, making it ideal for a myriad of applications, from consumer electronics to industrial systems. With its compact design and robust operating range, it delivers exceptional performance while ensuring efficient power usage. Trust in ST’s reputation for quality and transform your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into circuit designs and saves space on PCBs.

Package Shape: SQUARE

The square shape facilitates efficient use of board space and simplifies layout designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enables higher data transfer rates, enhancing overall performance in high-speed applications.

Nominal Supply Voltage / Vsup: 3.3V

A nominal supply voltage of 3.3V is standard for many modern electronic devices, ensuring compatibility and reducing design complexity.

No. of Terminals: 52

The presence of 52 terminals allows for a rich set of functions and connections, making it versatile for various configurations.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging supports efficient heat dissipation and is suited for mounting on PCBs effectively.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this memory chip is reliable for applications in warmer environments.

Organization: 128KX8

The 128KX8 organization allows for efficient data handling and retrieval, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

Operating from 0 °C makes this product suitable for standard commercial applications without the need for special environments.

Terminal Position: QUAD

Quad terminal positioning allows for better signal integrity and reduced interference, enhancing overall performance.

Maximum Seated Height: 4.57 mm

A compact seated height of 4.57 mm facilitates space-saving designs, ideal for modern electronic devices.

Width: 19 mm

With a width of 19 mm, it fits well in compact electronic designs, providing flexibility in PCB layout.

Minimum Supply Voltage (Vsup): 3V

Supports a minimum supply voltage of 3V, increasing its usability with various power configurations.

Type: NOR TYPE

NOR type flash memory is known for its reliability and fast random access, making it suitable for code storage and quick data retrieval.

Length: 19.1 mm

A length of 19.1 mm ensures compatibility with existing designs while maintaining a compact footprint.

Programming Voltage (V): 3.3V

The programming voltage of 3.3V aligns with standard logic levels, making it easier to integrate into existing systems without issues.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures adequate performance for everyday applications, providing a good balance between cost and functionality.

Technology: CMOS

CMOS technology offers low power consumption, which is essential for battery-operated devices and energy-efficient designs.

Parallel or Serial: PARALLEL

Parallel operation modes allow for faster data transfers compared to serial connections, suitable for high-speed applications.

Terminal Form: J BEND

J bend terminals provide secure mounting and robust connections, reducing the risk of solder joint failures.

No. of Words: 131072 words

The memory can store a substantial amount of data, making it suitable for applications requiring significant data storage.

Memory Width: 8

An 8-bit memory width is standard in many applications, providing a good balance between data throughput and complexity.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact placements on the PCB, accommodating dense designs.

No. of Words Code: 128K

The 128K words capacity is efficient for applications such as firmware storage and system configurations.

Maximum Supply Voltage (Vsup): 3.6V

Supports a maximum supply voltage of 3.6V, ensuring compatibility with a wide range of power supplies and designs.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of 10 ms allows for quick data updates, enhancing performance in dynamic applications.

Memory Density: 1048576 bit

With a memory density of 1048576 bits, it can efficiently handle larger data sets, which is crucial for advanced applications.

Memory IC Type: FLASH

Being a FLASH memory IC, it provides non-volatile storage, retaining data without power, ideal for permanent data storage.

Maximum Access Time: 12 ns

A fast maximum access time of 12 ns ensures quick retrieval of stored data, enhancing system responsiveness.

Technical Specifications

Flash Memory PSD813F1AV-12JT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

12 ns

JESD-30 Code:

S-PQCC-J52

Length:

19.1 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

19 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-12JT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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