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PSD813F1AV-90JT

STMicroelectronics

PSD813F1AV-90JT by STMicroelectronics

PSD813F1AV-90JT from STMicroelectronics is a 128Kx8 NOR Flash memory with a max access time of 90 ns. It operates at a nominal voltage of 3.3V and features a compact chip carrier package. Ideal for synchronous applications, it supports commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,925 parts In-Stock

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3,925

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Digiode

USA . 3,202 parts In-Stock

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3,202

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Anansix

USA . 1,835 parts In-Stock

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1,835

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,288 parts In-Stock

1+ parts

$5.291

100+ parts

-

1k+ parts

$4.762

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2,288

$5.291

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$4.762

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MKK Technologies

India . 1,853 parts In-Stock

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$9.949

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1,853

$9.949

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DigiPath Technology Company

USA . 1,853 parts In-Stock

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$9.949

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1,853

$9.949

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Parana Technologies

USA . 1,849 parts In-Stock

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$6.326

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1,849

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$6.326

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Corphita

USA . 78 parts In-Stock

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Overview

Unlock the potential of your projects with the PSD813F1AV-90JT from STMicroelectronics, a leader in innovative flash memory solutions. This high-quality NOR-type memory offers exceptional speed and reliability, perfect for a wide range of applications, from consumer electronics to automotive systems. With its compact design and robust performance, you can enhance product efficiency while enjoying the peace of mind that comes from partnering with a trusted manufacturer. Experience superior value, unmatched durability, and seamless integration that elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making it suitable for high-density applications.

Package Shape: SQUARE

A square package shape can optimize space utilization on the PCB layout, supporting higher component density.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data processing and improved performance in data transfer.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at 3.3 V ensures compatibility with most modern devices while maintaining power efficiency.

No. of Terminals: 52

A higher number of terminals can provide more functionality and networking capabilities within a compact form factor.

Package Style (Meter): CHIP CARRIER

Chip carrier style allows for better heat dissipation and is suitable for applications requiring sourced ICs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in a range of environments, making it a versatile choice.

Organization: 128KX8

This organization structure facilitates efficient memory access patterns, supporting efficient data retrieval.

Minimum Operating Temperature: 0 °C

Suitable for various applications, including outdoor environments, where temperatures may drop to 0 °C.

Terminal Position: QUAD

Quad terminal positioning can provide reduced inductance, improving electrical performance.

Maximum Seated Height: 4.57 mm

The compact seated height saves space in device design, allowing for thinner products.

Width: 19 mm

A width of 19 mm strikes a balance between compactness and ease of handling during assembly.

Minimum Supply Voltage (Vsup): 3 V

Flexibility to operate at a lower voltage enhances compatibility with power-sensitive applications.

Type: NOR TYPE

NOR flash memory is ideal for applications requiring fast read speeds and ease of random access.

Length: 19.1 mm

The specific length provides standardization, ensuring compatibility with many existing designs.

Programming Voltage (V): 3.3

A programming voltage of 3.3 V ensures compatibility with low-voltage logic systems, enhancing integration.

Temperature Grade: COMMERCIAL

Commercial grade suitability ensures the product can be used in consumer electronics without stringent temperature controls.

Technology: CMOS

CMOS technology allows for low power consumption, which is essential for battery-operated devices.

Parallel or Serial: PARALLEL

Parallel interface offers higher data throughput compared to serial, making it suitable for high-performance applications.

Terminal Form: J BEND

J bend terminals can simplify soldering and improve mechanical stability during assembly.

No. of Words: 131072 words

A large number of memory words accommodates various application needs, allowing for versatile data storage.

Memory Width: 8

An 8-bit memory width is common in many applications, providing a good balance between performance and complexity.

Terminal Pitch: 1.27 mm

A 1.27 mm pitch allows for reliable soldering and compatibility with standard PCB layouts.

No. of Words Code: 128K

With 128K words of memory, it can support a wide range of applications requiring moderate storage capacity.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V gives a leeway for slight voltage variations in the power supply.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle times allow for efficient programming of data, enhancing overall system performance.

Memory Density: 1048576 bit

With a density of 1 Mb, it provides significant storage capacity suitable for many applications.

Memory IC Type: FLASH

Flash memory allows for non-volatile storage, making it ideal for data retention when power is off.

Maximum Access Time: 90 ns

A maximum access time of 90 ns ensures rapid retrieval of data, beneficial for high-speed applications.

Technical Specifications

Flash Memory PSD813F1AV-90JT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

JESD-30 Code:

S-PQCC-J52

Length:

19.1 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

19 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-90JT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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