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PSD813F1AV-70UIT

STMicroelectronics

PSD813F1AV-70UIT by STMicroelectronics

PSD813F1AV-70UIT from STMicroelectronics is a low-profile NOR flash memory with a 3.3V supply, featuring 128Kx8 organization and a max access time of 70 ns. It operates in synchronous mode, ideal for industrial applications requiring reliable data storage. With a wide temp range (-40 °C to 85 °C), it suits various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,735 parts In-Stock

1+ parts

-

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3,735

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Anansix

USA . 1,605 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,605

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Vyrian

USA . 579 parts In-Stock

1+ parts

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579

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 544 parts In-Stock

1+ parts

$4.065

100+ parts

-

1k+ parts

$3.659

10k+ parts

-

544

$4.065

-

$3.659

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MKK Technologies

India . 2,176 parts In-Stock

1+ parts

$7.645

100+ parts

-

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10k+ parts

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2,176

$7.645

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DigiPath Technology Company

USA . 2,176 parts In-Stock

1+ parts

$7.645

100+ parts

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10k+ parts

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2,176

$7.645

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Parana Technologies

USA . 1,753 parts In-Stock

1+ parts

-

100+ parts

$4.861

1k+ parts

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1,753

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$4.861

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Corphita

USA . 890 parts In-Stock

1+ parts

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890

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Overview

Unlock unparalleled performance with the PSD813F1AV-70UIT from STMicroelectronics, a leader in innovative flash memory solutions. Designed for durability and efficiency, this versatile NOR flash memory is perfect for industrial applications where reliability is paramount. With its low-profile design and robust temperature tolerance, it seamlessly enhances your designs while delivering rapid access times and low power consumption. Elevate your projects with ST’s trusted quality and outstanding customer support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental stress, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of PCB space, making integration easier in modern electronic devices.

Package Shape: SQUARE

The square package shape optimizes space utilization on printed circuit boards, providing flexibility in design.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance by allowing coordinated data transfers, resulting in increased efficiency in data handling.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3 V is standard for many digital circuits, ensuring compatibility with various systems.

No. of Terminals: 64

With 64 terminals, this product provides ample connectivity for complex applications, supporting more extensive data and control lines.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile flatpack design is advantageous for space-constrained applications, allowing for a thinner profile in devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this product suitable for industrial applications where high temperatures are prevalent.

Organization: 128KX8

This organization specification allows the memory to store a significant amount of data, making it useful for applications requiring ample storage capacity.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme environments, ideal for industrial and automotive uses.

Terminal Position: QUAD

Quad terminal positioning provides enhanced signal integrity and noise immunity, improving overall performance in memory applications.

Maximum Seated Height: 1.54 mm

With a maximum seated height of 1.54 mm, this product is well-suited for use in low-profile electronic designs.

Width: 14 mm

A width of 14 mm offers a balanced design for various applications, ensuring compatibility with existing form factors.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V allows for flexibility in power supply design, making it versatile for different applications.

Type: NOR TYPE

As a NOR type memory, this product provides fast access times and flexible data management, making it fit for many applications.

Length: 14 mm

The 14 mm length contributes to a compact footprint, allowing for efficient space utilization on PCB layouts.

Programming Voltage (V): 3.3 V

A programming voltage of 3.3 V simplifies the design and compatibility with common digital circuits.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable performance under harsh conditions, making it ideal for mission-critical settings.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, enhancing overall system efficiency.

Parallel or Serial: PARALLEL

Parallel communication mode allows for faster data transfers, increasing the overall performance of memory-rich applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easier soldering and handling during assembly, improving manufacturing efficiency.

No. of Words: 131072 words

With a capacity of 131072 words, this memory can support substantial data storage needs in various applications.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and is well-suited to common data architectures.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch optimizes space while ensuring compatibility with various PCB designs.

No. of Words Code: 128K

An adequate word code of 128K ensures sufficient addressing for various applications, making it a versatile choice.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V supports a range of power supply designs, enhancing the product's adaptability in diverse environments.

Maximum Write Cycle Time (tWC): 10 ms

A write cycle time of 10 ms allows for efficient updates to stored data, catering to applications that require frequent write operations.

Memory Density: 1048576 bit

With a memory density of 1048576 bits, this product offers significant storage capacity for complex applications.

Memory IC Type: FLASH

As a flash memory IC type, it provides non-volatile storage, ensuring data retention without power, ideal for critical data applications.

Maximum Access Time: 70 ns

A maximum access time of 70 ns allows for rapid data retrieval, improving the responsiveness of applications.

Technical Specifications

Flash Memory PSD813F1AV-70UIT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

64

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.54 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

14 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-70UIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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