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PSD813F1AV-90MT

STMicroelectronics

PSD813F1AV-90MT by STMicroelectronics

PSD813F1AV-90MT from STMicroelectronics is a 128Kx8 NOR Flash memory with a max access time of 90 ns and operates at a nominal voltage of 3.3V. Its compact flatpack design makes it ideal for space-constrained applications. This synchronous device supports parallel interfacing, ensuring efficient data transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,206 parts In-Stock

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Digiode

USA . 1,826 parts In-Stock

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1,826

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Anansix

USA . 714 parts In-Stock

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714

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$3.812

100+ parts

-

1k+ parts

$3.431

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749

$3.812

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$3.431

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MKK Technologies

India . 1,474 parts In-Stock

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$7.169

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1,474

$7.169

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DigiPath Technology Company

USA . 1,474 parts In-Stock

1+ parts

$7.169

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1,474

$7.169

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Corphita

USA . 3,129 parts In-Stock

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3,129

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Parana Technologies

USA . 720 parts In-Stock

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$4.558

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720

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$4.558

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Overview

Unlock exceptional performance with the PSD813F1AV-90MT from STMicroelectronics, a leader in innovative semiconductor solutions. Renowned for their reliability and advanced technology, STMicroelectronics delivers this high-quality Flash Memory, ideal for a myriad of applications—from consumer electronics to industrial automation. Experience faster data access times and seamless integration, ensuring your projects achieve peak efficiency and longevity. Elevate your designs with precision and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and robustness, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on printed circuit boards, making integration into compact designs easier.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on PCBs, enhancing design flexibility.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster data transfer rates, improving overall performance in high-speed applications.

Nominal Supply Voltage / Vsup: 3.3 V

A standard supply voltage of 3.3 V ensures compatibility with most digital circuits and low power consumption.

No. of Terminals: 52

With 52 terminals, this memory chip supports a wide range of connections, facilitating complex circuit designs.

Package Style (Meter): FLATPACK

Flatpack design enhances efficiency in mounting and thermal performance, crucial for high-density applications.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C allows use in various commercial environments, ensuring stability in diverse conditions.

Organization: 128KX8

The 128Kx8 organization provides a good balance between capacity and speed, suitable for many applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can be used in a variety of environments without performance degradation.

Terminal Position: QUAD

Quad terminal positioning allows for improved connection integrity and signal quality, enhancing performance.

Maximum Seated Height: 2.35 mm

Being low profile (maximum seated height of 2.35 mm) is ideal for compact designs where space is a premium.

Width: 10 mm

A width of 10 mm helps in maintaining a compact PCB layout while providing adequate space for wiring.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V ensures lower energy consumption, enhancing efficiency in battery-powered applications.

Type: NOR TYPE

NOR type architecture is known for its fast read speeds, making it suitable for applications requiring swift data retrieval.

Length: 10 mm

At 10 mm long, the product maintains great dimensional efficiency, which is critical for space-constrained designs.

Programming Voltage (V): 3.3 V

A programming voltage of 3.3 V simplifies design requirements while ensuring optimal performance in various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading assures that the part can reliably operate in standard environmental conditions.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity, making this product an ecologically friendly choice.

Parallel or Serial: PARALLEL

Parallel interface permits faster data access, enhancing performance for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and robust mechanical connections, ensuring reliability.

No. of Words: 131072 words

With a total of 131072 words, this memory allows for substantial data storage capacity for a variety of applications.

Memory Width: 8

An 8-bit memory width is ideal for most digital applications, offering a balance of data handling capability and efficiency.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch enhances compatibility with modern PCB designs and improves space utilization.

No. of Words Code: 128K

Supporting 128K words code offers enough capacity for many applications, from consumer electronics to industrial systems.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for flexible power supply options, ensuring compatibility across various systems.

Maximum Write Cycle Time (tWC): 10 ms

A write cycle time of 10 ms delivers efficient writing speeds, making it suitable for applications requiring frequent updates.

Memory Density: 1048576 bit

With a memory density of 1048576 bits, this product allows for substantial data storage, ideal for modern applications.

Memory IC Type: FLASH

Flash memory type ensures non-volatile storage, retaining data even when power is removed, which is crucial in many applications.

Maximum Access Time: 90 ns

With a maximum access time of 90 ns, this product offers rapid data retrieval, enhancing system performance.

Technical Specifications

Flash Memory PSD813F1AV-90MT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

10 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-90MT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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