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PSD813F1AV-12MIT

STMicroelectronics

PSD813F1AV-12MIT by STMicroelectronics

PSD813F1AV-12MIT from STMicroelectronics is a 128Kx8 NOR Flash memory with a synchronous operating mode and a max access time of 12 ns. It operates b/w -40 °C to 85 °C, making it ideal for industrial applications. Its compact flatpack design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,265 parts In-Stock

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2,265

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Digiode

USA . 1,953 parts In-Stock

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1,953

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Vyrian

USA . 1,920 parts In-Stock

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1,920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 43 parts In-Stock

1+ parts

$4.790

100+ parts

-

1k+ parts

$4.311

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43

$4.790

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$4.311

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MKK Technologies

India . 1,107 parts In-Stock

1+ parts

$9.006

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1,107

$9.006

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DigiPath Technology Company

USA . 1,107 parts In-Stock

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$9.006

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1,107

$9.006

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Parana Technologies

USA . 2,280 parts In-Stock

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$5.727

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2,280

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$5.727

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Corphita

USA . 1,546 parts In-Stock

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Overview

Unlock the potential of your projects with the PSD813F1AV-12MIT flash memory from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers superior performance in a compact design, perfect for industrial applications. Benefit from rapid access times and a robust temperature range, ensuring your solutions are both efficient and resilient. Elevate your designs with trusted quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and high-density PCB layouts, ideal for modern electronics.

Package Shape: SQUARE

The square package shape is efficient for space-saving designs and provides ease of placement on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation enables higher data transfer rates, improving overall performance in data-intensive applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with most electronic circuits and lowers power consumption.

No. of Terminals: 52

A higher number of terminals allows for more connections and increased functionality in compact setups.

Package Style (Meter): FLATPACK

Flatpack package style enhances thermal performance and is easier to mount on PCBs, making it ideal for industrial applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in harsh environments.

Organization: 128KX8

The 128Kx8 organization allows for efficient data storage, balancing capacity and accessibility.

Minimum Operating Temperature: -40 °C

Extreme temperature tolerance ensures reliable performance in temperature-sensitive applications.

Terminal Position: QUAD

Quad terminal positioning provides improved signal integrity and easier routing on the circuit board.

Maximum Seated Height: 2.35 mm

A low seated height helps save space in compact designs while ensuring compatibility with various mounting options.

Width: 10 mm

The compact width makes it an ideal choice for space-constrained applications without sacrificing performance.

Minimum Supply Voltage (Vsup): 3 V

Operating with a minimum supply voltage of 3V enhances versatility and ensures functionality in power-sensitive designs.

Type: NOR TYPE

NOR type flash memory offers fast read speeds and easy random access, enhancing performance in various applications.

Length: 10 mm

A compact length complements the overall small package design, facilitating efficient use of space.

Programming Voltage (V): 3.3

The programming voltage of 3.3V simplifies integration into existing systems while maintaining low power consumption.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring high reliability and stability under varying operational conditions.

Technology: CMOS

CMOS technology enhances energy efficiency and scalability, making this product suitable for a range of electronic devices.

Parallel or Serial: PARALLEL

Parallel memory access allows for faster data transfers, making it ideal for high-performance applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve the connection reliability on PCBs.

No. of Words: 131072 words

With 131072 words, this memory capacity balances performance and storage needs for various applications.

Memory Width: 8

An 8-bit memory width allows for efficient data management and compatibility with standard data architectures.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch enables dense packaging, supporting modern miniaturization trends in electronics.

No. of Words Code: 128K

A coding of 128K for words denotes an ample storage capability, making this product suitable for diverse applications.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows operational flexibility while ensuring stable performance.

Maximum Write Cycle Time (tWC): 10 ms

The fast write cycle time of 10 ms increases efficiency, allowing for quicker data updates in critical applications.

Memory Density: 1048576 bit

With a memory density of 1048576 bits, this product can store substantial data while remaining compact.

Memory IC Type: FLASH

As a flash memory IC, it offers non-volatile storage and faster access times compared to traditional memory technologies.

Maximum Access Time: 12 ns

A maximum access time of 12 ns ensures rapid data retrieval, enhancing the overall system performance in high-speed applications.

Technical Specifications

Flash Memory PSD813F1AV-12MIT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

12 ns

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

10 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-12MIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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