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PSD813F1VA-15J

STMicroelectronics

PSD813F1VA-15J by STMicroelectronics

PSD813F1VA-15J by STMicroelectronics is a 128Kx8 NOR Flash memory with a synchronous operating mode and a max access time of 15 ns. It operates at a nominal voltage of 3.3V, suitable for commercial applications. This compact chip carrier design ensures efficient performance in various electronic devices.

Median Price

$15.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 9 parts In-Stock

1+ parts

$15.000

100+ parts

-

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9

$15.000

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Vyrian

USA . 8,490 parts In-Stock

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8,490

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Anansix

USA . 1,096 parts In-Stock

1+ parts

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1,096

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Digiode

USA . 821 parts In-Stock

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821

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Flip Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,279 parts In-Stock

1+ parts

$4.674

100+ parts

-

1k+ parts

$4.206

10k+ parts

-

1,279

$4.674

-

$4.206

-

Microchip USA

USA . 262 parts In-Stock

1+ parts

$7.818

100+ parts

-

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262

$7.818

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MKK Technologies

India . 477 parts In-Stock

1+ parts

$8.788

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477

$8.788

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DigiPath Technology Company

USA . 477 parts In-Stock

1+ parts

$8.788

100+ parts

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477

$8.788

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AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$9.350

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758

$9.350

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Corphita

USA . 734 parts In-Stock

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734

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Parana Technologies

USA . 531 parts In-Stock

1+ parts

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$5.588

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531

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$5.588

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Perfect Parts

USA . 489 parts In-Stock

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489

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Overview

Unlock powerful performance with the PSD813F1VA-15J Flash Memory from STMicroelectronics! Renowned for their innovation and reliability, STMicroelectronics offers a solution that combines superior memory technology with exceptional speed. Ideal for a wide range of applications—from consumer electronics to automotive systems—this compact chip delivers outstanding efficiency and longevity, ensuring your devices run smoothly and effectively. Experience quality and advancement in every byte!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliability and ease of integration into various devices.

Surface Mount: YES

Designed for surface mounting which allows for more compact and efficient PCB layouts.

Package Shape: SQUARE

Square shape provides a uniform footprint, facilitating even heat distribution and placement on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speeds, making the device suitable for high-performance applications.

Nominal Supply Voltage / Vsup: 3.3 V

Standard voltage level compatible with most modern digital systems, ensuring versatile application.

No. of Terminals: 52

A higher number of terminals provides multiple connectivity options, enhancing versatility in designs.

Package Style (Meter): CHIP CARRIER

Chip carrier design supports robust electrical performance and ease of mounting.

Maximum Operating Temperature: 70 °C

High operational temperature range ensures reliability in various environmental conditions.

Organization: 128KX8

Efficient organization structure provides adequate capacity for data storage and quick access.

Minimum Operating Temperature: 0 °C

This range allows usage in standard room temperature environments while maintaining performance.

Terminal Position: QUAD

Quad terminal position allows for flexible layout options, improving design efficiency.

Maximum Seated Height: 4.57 mm

Low height profile allows for integration in space-constrained applications.

Width: 19 mm

Compact width suitable for various applications without taking excessive board space.

Minimum Supply Voltage (Vsup): 3 V

Allows operation at lower supply voltages, contributing to power efficiency.

Type: NOR TYPE

NOR type tends to offer faster access times and better performance for random read operations.

Length: 19.1 mm

Compact length complements the overall small footprint of the chip, aiding in board space management.

Programming Voltage (V): 3.3

Standard programming voltage aligns with most electronic standards, facilitating ease of use.

Temperature Grade: COMMERCIAL

Commercial grade indicates suitability for a wide range of consumer applications.

Technology: CMOS

CMOS technology enables low power consumption while maintaining performance efficiency.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer rates, improving overall system performance.

Terminal Form: J BEND

J bend terminals provide strong mechanical connections, enhancing durability and ease of soldering.

No. of Words: 131072 words

Adequate memory capacity suitable for a variety of applications such as code storage and data logging.

Memory Width: 8

8-bit memory width offers a good balance between performance and storage capabilities.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with common PCB layouts and manufacturing processes.

No. of Words Code: 128K

This coding allows for efficient memory organization, making it suitable for embedded applications.

Maximum Supply Voltage (Vsup): 3.6 V

Higher voltage flexibility offers improved performance and operational reliability.

Maximum Write Cycle Time (tWC): 10 ms

Short write cycle time enhances the device's speed in data writing applications.

Memory Density: 1048576 bit

High memory density provides ample storage capacity for complex applications.

Memory IC Type: FLASH

Flash memory type allows for non-volatile storage, maintaining data integrity even without power.

Maximum Access Time: 15 ns

Fast access time ensures that data retrieval is quick and efficient, enhancing overall performance.

Technical Specifications

Flash Memory PSD813F1VA-15J attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

15 ns

JESD-30 Code:

S-PQCC-J52

Length:

19.1 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

19 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1VA-15J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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