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PSD813F1AV-70MT

STMicroelectronics

PSD813F1AV-70MT by STMicroelectronics

PSD813F1AV-70MT by STMicroelectronics is a 128Kx8 NOR Flash memory with a 3.3V supply, ideal for synchronous applications. It features a max access time of 70 ns and operates in temperatures from 0 °C to 70 °C. This compact flatpack design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,149 parts In-Stock

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4,149

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Anansix

USA . 876 parts In-Stock

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876

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Vyrian

USA . 61 parts In-Stock

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61

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 503 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

$2.276

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503

$2.529

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$2.276

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MKK Technologies

India . 1,795 parts In-Stock

1+ parts

$4.756

100+ parts

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1,795

$4.756

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DigiPath Technology Company

USA . 1,795 parts In-Stock

1+ parts

$4.756

100+ parts

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1,795

$4.756

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Corphita

USA . 2,515 parts In-Stock

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2,515

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Parana Technologies

USA . 213 parts In-Stock

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$3.024

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213

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$3.024

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Overview

Unlock the potential of your designs with the PSD813F1AV-70MT from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality Flash Memory offers exceptional performance and reliability, making it ideal for demanding applications like consumer electronics, automotive systems, and industrial automation. Experience faster data access and efficient power consumption, ensuring your products stand out in today’s competitive landscape. Choose STMicroelectronics for unmatched excellence and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the chip from environmental damage.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic devices.

Package Shape: SQUARE

A square package shape facilitates efficient space utilization on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer rates, enhancing overall performance.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3 V is compatible with most modern digital systems.

No. of Terminals: 52

With 52 terminals, this product provides extensive connectivity options for various applications.

Package Style (Meter): FLATPACK

The flatpack style contributes to a low profile, allowing for compatibility with space-constrained designs.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures reliability in a wide range of environmental conditions.

Organization: 128KX8

An organization of 128K x 8 allows for efficient memory storage configuration and access.

Minimum Operating Temperature: 0 °C

This range ensures functionality in various climates, making it versatile for different applications.

Terminal Position: QUAD

Quad terminal positioning supports high-speed data transfer and improves electrical performance.

Maximum Seated Height: 2.35 mm

A low maximum seated height ensures compatibility with low-profile applications.

Width: 10 mm

A compact width facilitates use in space-constrained applications without sacrificing performance.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V makes the product usable in various electronic circuits.

Type: NOR TYPE

NOR type memory offers fast access times and is ideal for applications requiring efficient reading.

Length: 10 mm

With a 10 mm length, the memory chip maintains a compact profile, enhancing design flexibility.

Programming Voltage: 3.3 V

A programming voltage of 3.3 V aligns with common digital operation voltages, simplifying design integration.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation for standard consumer electronics.

Technology: CMOS

CMOS technology enables lower power consumption, increasing battery life in portable devices.

Parallel or Serial: PARALLEL

Parallel communication enhances data transfer rates, making it suitable for high-performance applications.

Terminal Form: GULL WING

Gull wing terminals ensure strong mechanical connections and easier soldering processes.

No. of Words: 131072 words

A capacity of 131072 words allows for substantial data storage, suitable for a wide array of applications.

Memory Width: 8

An 8-bit memory width matches typical data bus widths, facilitating integration with standard systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is compatible with modern PCB designs, ensuring ease of assembly.

No. of Words Code: 128K

128K words of code offers ample memory for applications needing both storage and fast accessibility.

Maximum Supply Voltage: 3.6 V

This higher supply voltage ensures stability under variable power conditions of connected devices.

Maximum Write Cycle Time: 10 ms

A maximum write cycle time of 10 ms provides efficient writing speed for rapid data updates.

Memory Density: 1048576 bit

With a memory density of 1048576 bits, this chip allows for significant data storage in a compact form.

Memory IC Type: FLASH

The FLASH memory type provides non-volatile storage, retaining data even without power.

Maximum Access Time: 70 ns

A maximum access time of 70 ns enables quick data retrieval, essential for high-speed applications.

Technical Specifications

Flash Memory PSD813F1AV-70MT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

10 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-70MT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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