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PSD813F1AV-70MIT

STMicroelectronics

PSD813F1AV-70MIT by STMicroelectronics

PSD813F1AV-70MIT from STMicroelectronics is a 128Kx8 NOR Flash memory with a synchronous operating mode, ideal for industrial applications. It operates at 3.0-3.6V and features a max access time of 70ns and temp range of -40 °C to 85 °C. Its compact flatpack design ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,211 parts In-Stock

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4,211

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Vyrian

USA . 2,057 parts In-Stock

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2,057

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Anansix

USA . 1,354 parts In-Stock

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1,354

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,320 parts In-Stock

1+ parts

$3.391

100+ parts

-

1k+ parts

$3.052

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2,320

$3.391

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$3.052

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MKK Technologies

India . 866 parts In-Stock

1+ parts

$6.377

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866

$6.377

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DigiPath Technology Company

USA . 866 parts In-Stock

1+ parts

$6.377

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866

$6.377

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Corphita

USA . 530 parts In-Stock

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530

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Parana Technologies

USA . 89 parts In-Stock

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$4.055

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89

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$4.055

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Overview

Unlock the power of innovation with the PSD813F1AV-70MIT from STMicroelectronics, a leader in cutting-edge technology. This advanced Flash Memory solution delivers exceptional reliability and performance for a wide range of applications, from automotive systems to industrial controls. With its robust design and efficient operation across extreme temperatures, it ensures uninterrupted functionality. Elevate your projects with superior quality and unmatched support from STMicroelectronics, maximizing value for your business!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental stress, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern circuit boards, enhancing the product's versatility.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, allowing for efficient layouts and potentially reducing manufacturing costs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, making this flash memory ideal for high-performance applications.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3 V is compatible with most modern electronic devices, ensuring easy integration.

No. of Terminals: 52

With 52 terminals, this memory device offers extensive connections for flexibility in system design.

Package Style (Meter): FLATPACK

The flatpack style enables low-profile mounting on PCBs, saving valuable space in compact electronic applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows for use in a variety of high-temperature environments, enhancing reliability.

Organization: 128KX8

This organization allows for efficient use of memory blocks, making it suitable for applications needing compact data storage.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40 °C ensures reliability in extreme conditions.

Terminal Position: QUAD

The quad terminal position aids in parallel data access, facilitating faster read/write operations.

Maximum Seated Height: 2.35 mm

Being compact in height, it is ideal for applications where space is a premium, such as portable devices.

Width: 10 mm

The 10 mm width balances footprint and connectivity needs, making it flexible for different circuit designs.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V ensures compatibility with a wide range of electronic components.

Type: NOR TYPE

NOR type memory offers fast access times and is ideal for code storage applications.

Length: 10 mm

The compact 10 mm length complements its width for space-efficient mounting on printed circuit boards.

Programming Voltage: 3.3 V

This programming voltage minimizes power consumption during operations, making it energy-efficient.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures durability and performance in challenging environments.

Technology: CMOS

CMOS technology facilitates lower power consumption and supports high-speed operation.

Parallel or Serial: PARALLEL

Parallel interface allows for rapid data transfer, making it suitable for applications requiring quick access.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and provide robust mechanical support on PCB.

No. of Words: 131072 words

With 131072 words of storage, it is capable of handling substantial data for a variety of applications.

Memory Width: 8

An 8-bit memory width aligns with standard data processing requirements, making integration straightforward.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for a denser layout on the PCB while maintaining reliability in connections.

No. of Words Code: 128K

The storage capacity of 128K is ideal for many embedded applications requiring moderate data sizes.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for power supply configurations.

Maximum Write Cycle Time (tWC): 10 ms

A write cycle time of 10 ms ensures efficient data updates, suitable for applications needing quick rewrites.

Memory Density: 1048576 bit

With a density of 1 Mbit, it balances capacity and performance for a variety of applications.

Memory IC Type: FLASH

Flash memory type ensures non-volatile storage, making it ideal for data retention even without power.

Maximum Access Time: 70 ns

A maximum access time of 70 ns allows for swift data retrieval, enhancing overall system performance.

Technical Specifications

Flash Memory PSD813F1AV-70MIT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

10 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-70MIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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