Loading...

PSD813F1AV-90UT

STMicroelectronics

PSD813F1AV-90UT by STMicroelectronics

PSD813F1AV-90UT from STMicroelectronics is a 128Kx8 NOR Flash memory with a max access time of 90 ns and operates at 3.3V. Its low-profile, square package design makes it ideal for compact applications. This CMOS device supports synchronous operation in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,971

-

-

-

-

Vyrian

USA . 527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

527

-

-

-

-

Anansix

USA . 244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

244

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 516 parts In-Stock

1+ parts

$5.048

100+ parts

-

1k+ parts

$4.543

10k+ parts

-

516

$5.048

-

$4.543

-

MKK Technologies

India . 552 parts In-Stock

1+ parts

$9.493

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$9.493

-

-

-

DigiPath Technology Company

USA . 552 parts In-Stock

1+ parts

$9.493

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$9.493

-

-

-

Corphita

USA . 2,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,895

-

-

-

-

Parana Technologies

USA . 1,442 parts In-Stock

1+ parts

-

100+ parts

$6.036

1k+ parts

-

10k+ parts

-

1,442

-

$6.036

-

-

Overview

Unlock the future of reliable storage with the PSD813F1AV-90UT from STMicroelectronics, a leader in innovative memory solutions. Designed for efficiency and durability, this high-performance flash memory ensures fast, synchronous operations for your critical applications, from consumer electronics to automotive systems. Experience unparalleled quality and support from a trusted manufacturer, empowering your projects with unmatched reliability and seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring protection against environmental factors while maintaining a low profile.

Surface Mount: YES

Enables efficient use of space on the PCB and allows for automated assembly processes.

Package Shape: SQUARE

Facilitates efficient use of board space and simplifies integration into various designs.

Operating Mode: SYNCHRONOUS

Offers faster data transfer rates, improving overall system performance.

Nominal Supply Voltage / Vsup: 3.3 V

Widely compatible with modern electronics, ensuring ease of integration.

No. of Terminals: 64

Provides ample connectivity for data transfer, enhancing performance and flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE

Ideal for space-constrained applications, allowing for compact device designs.

Maximum Operating Temperature: 70 °C

Suitable for a wide range of environments, ensuring reliable operation in various applications.

Organization: 128KX8

Offers a balanced memory organization that can optimize speed and efficiency in data access.

Minimum Operating Temperature: 0 °C

Ensures functionality in a wide range of applications, from commercial to light industrial.

Terminal Position: QUAD

Allows for efficient routing on PCBs, supporting better performance in multi-chip configurations.

Maximum Seated Height: 1.54 mm

Low profile ensures compatibility with slim designs and contributes to overall space savings.

Width: 14 mm

Standard width that accommodates various PCB designs and layouts.

Minimum Supply Voltage (Vsup): 3 V

Provides flexibility in power supply configurations, accommodating different system designs.

Type: NOR TYPE

Offers faster random access capabilities compared to other memory types, improving overall system responsiveness.

Length: 14 mm

Standard dimension that fits well in a variety of hardware setups, maximizing compatibility.

Programming Voltage (V): 3.3

Simplifies circuit design while ensuring stable operation within specified limits.

Temperature Grade: COMMERCIAL

Designed for dependable performance in typical commercial environments.

Technology: CMOS

Enables low power consumption and high efficiency, making it suitable for battery-operated devices.

Parallel or Serial: PARALLEL

Allows for higher data transfer rates compared to serial configurations, making it suitable for applications requiring speed.

Terminal Form: GULL WING

Ensures ease of soldering to PCB, providing reliable mechanical and electrical connectivity.

No. of Words: 131072 words

A substantial memory size that supports a wide range of applications and data storage needs.

Memory Width: 8

Provides optimal data handling capabilities, facilitating efficient data operations.

Terminal Pitch: 0.8 mm

Accommodates fine-pitch assembly techniques, making it suitable for dense layout designs.

No. of Words Code: 128K

Well-suited for applications requiring moderate memory capacity while maintaining performance.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a broad range of operating conditions, contributing to versatility in design integration.

Maximum Write Cycle Time (tWC): 10 ms

Allows for effective write operations, making it suitable for applications with frequent data updates.

Memory Density: 1048576 bit

Provides ample storage for diverse applications, enhancing overall functionality.

Memory IC Type: FLASH

Offers non-volatile storage, retaining data without power and ensuring reliability in various applications.

Maximum Access Time: 90 ns

Ensures quick data retrieval, improving system performance in data-intensive applications.

Technical Specifications

Flash Memory PSD813F1AV-90UT attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

64

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.54 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Type:

NOR TYPE

Width:

14 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PSD813F1AV-90UT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20