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D44C2

STMicroelectronics

D44C2 by STMicroelectronics

D44C2 by STMicroelectronics is a NPN Power BJT with 30V VCE, 4A IC, and 0.5V VCEsat. Ideal for switching applications, it has a max power dissipation of 30W and operates up to 150 °C. With a hFE of 20 and fT of 50MHz, this transistor is designed for high-performance in through-hole configurations.

Median Price

$6.675

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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DigiKey

USA . 50 parts In-Stock

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TEDSS.com

USA . 14 parts In-Stock

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$1.000

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American Microsemiconductor Inc.

USA . 2 parts In-Stock

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$12.350

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Vyrian

USA . 3,374 parts In-Stock

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Anansix

USA . 2,376 parts In-Stock

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Digiode

USA . 393 parts In-Stock

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DigiKey Marketplace

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LittleDiode

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IDEA Electronic Components Group

UK . 1,754 parts In-Stock

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$0.703

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$0.633

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MKK Technologies

India . 2,133 parts In-Stock

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$1.322

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DigiPath Technology Company

USA . 2,133 parts In-Stock

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$1.322

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Native Components

USA . 56 parts In-Stock

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$1.770

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Northwest PG Solutions

USA . 2,226 parts In-Stock

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$1.947

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 5,475 parts In-Stock

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Supply Digital

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Corphita

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Parana Technologies

USA . 1,187 parts In-Stock

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$0.840

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Experience superior performance and reliability with the D44C2 power transistor by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics guarantees top-quality products that deliver exceptional results. The D44C2 is perfect for switching applications, offering a maximum VCEsat of only 0.5V and a maximum collector current of 4A. With a minimum DC current gain of 20 and a nominal transition frequency of 50MHz, this NPN transistor provides unmatched efficiency and power dissipation of up to 30W. Trust STMicroelectronics to provide you with cutting-edge technology that meets all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the transistor lightweight and durable, ideal for use in various electronic applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, making this product versatile for different types of applications.

Configuration: SINGLE

Single configuration transistors are easier to work with and provide simple circuit design options.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures efficient and reliable performance in those scenarios.

Maximum VCEsat: 0.5 V

Low VCEsat ensures minimal power loss and high efficiency in operation.

Maximum Power Dissipation (Abs): 30 W

With a high power dissipation capability, this transistor can handle demanding applications without overheating.

Maximum Collector Current (IC): 4 A

High collector current allows for handling larger loads in a circuit.

Nominal Transition Frequency (fT): 50 MHz

A high transition frequency enables this transistor to operate at high speeds, making it suitable for fast-switching applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) D44C2 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

4 A

Maximum Collector-Emitter Voltage:

30 V

Configuration:

Minimum DC Current Gain (hFE):

20

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

30 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.5 V

Trade Compliance

D44C2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

NSN

5961-01-025-6702, 5961010256702

NIIN

010256702

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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